Apparatus and method for activating and providing multi-core configuration on bus

Abstract

An apparatus and method for activating and providing a multi-core configuration on a bus, wherein the bus is controlled by an initiative terminal impedance. The apparatus includes a first node, a location array and a plurality of drivers. The first node is arranged in a processor core and used for receiving an external multi-package signal, and the multi-package signal indicates whether the package upon which the processor core is disposed is internal to the bus or at a far end of the bus. The location array is arranged in the processor core and used for generating a plurality of location signals indicating locations of nodes coupled to the bus, wherein the locations are either an internal location or a bus end location. The plurality of drivers are coupled to the locations, each driver has one of the nodes and is used to control the node to be drive so as to respond a first state of a corresponding location signal of the location signals and a second state of the first node. The invention provides good bus initiative impedance control and preserves requiredd transmission line characteristics.

Description

technical field [0001] The present invention relates to microelectronics, and in particular to a mechanism for enabling and maintaining multiple processor contexts on a bus that require active control of bus termination impedance, wherein the multiple processor contexts include A processor package substrate (Processor Package Substrate) has a plurality of processor dies on it. Background technique [0002] Currently, in order to support fast incident wave switching (Incident Wave Switching) with low output amplitude (Low Output Swing), the bus architecture provides a point-to-point bus interface (Point- To-Point Bus Interface). In addition to providing a point-to-point bus interface, the bus architecture also requires the microprocessor (or other devices) to provide an internal termination impedance control circuit to dynamically adjust the termination impedance on the point-to-point bus, where the impedance value can generally be selected to match the characteristics of th...

AI Technical Summary

Problems solved by technology

Therefore, driving the I / O signal to the actual pull-up termination impedance will cause high frequency noise (High Frequency Noise), reflection (Reflection), ringing (Ringing), timing offset (Timing Displacement) and other defects

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