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Grinding tool and manufacturing method thereof

A technology for grinding tools and manufacturing methods, which is applied in the direction of manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., and can solve the problems that the abrasive particles cannot be limited, and the abrasive particles have the same protrusion amount.

Inactive Publication Date: 2010-09-29
HONGIA INDUSTRY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned technology of using holes to accommodate abrasive particles can only make the abrasive particles be positioned at a specific position, but cannot make the tip of the abrasive particles face upward and have the same amount of protrusion, and cannot use the shape of the hole itself to restrict the abrasive particles. Abrasive particles are hard to turn once positioned

Method used

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  • Grinding tool and manufacturing method thereof
  • Grinding tool and manufacturing method thereof
  • Grinding tool and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0042] see figure 1 shown. The preparation method of grinding tool of the present invention comprises the steps:

[0043] (a) Make the first ends 11 of a plurality of abrasive grains 10 respectively pass through a plurality of holes 21 of a fixed mold 20 against the bottom ends 32 of a plurality of grooves 31 of a reference platform 30, the plurality of abrasive grains 10 The second end 12 is respectively placed on the top of the fixed mold 20, such as image 3 , Figure 4 shown; wherein the fixed mold 20 is stacked above the reference platform 30, and the second end 12 of the abrasive grain 10 is positioned above the fixed mold 20, as image 3 , Figure 4 shown;

[0044] (b) make the first end surface 41 of a base plate 40 respectively against the second end 12 of a plurality of abrasive grains 10, there is a gap 51 between the base plate 40 and the fixed mold 20, as image 3 , Figure 4 shown;

[0045] (c) Make the bonding agent 71 spread in the gap 51 to form a bond...

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PUM

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Abstract

The invention discloses a grinding tool, comprising a plurality of abrasive grains, a fixed mould, a substrate and a bonding agent layer, wherein a plurality of pores of the fixed mould accommodate a plurality of abrasive grains respectively; a first end and a second end of each of the abrasive grains are respectively arranged below and above the fixed mould; a first end face of the substrate butts against the second ends of the abrasive grains respectively; the bonding agent layer bonds the abrasive grains, the fixed mould and the substrate together; the second end of the abrasive grain is a grinding end; the bonding agent layer is hidden at the inner side of the fixed mould so as not to be corroded owing to little possibility of contacting with liquid in the grinding process, and the abrasive grains are bonded by the fixed mould in order to conveniently control array pattern, spacing and exposed height of the abrasive grains, thereby fixing the abrasive grains more firmly and leading the abrasive grains to seldom fall off during the grinding.

Description

technical field [0001] The invention relates to a grinding tool, in particular to a grinding tool used in wafer manufacturing and a preparation method thereof. Background technique [0002] All kinds of grinding tools are widely used in the processing of stone, cement, glass, brick, ceramics, metal and other materials. Dressing tools used in wafer manufacturing. In order to obtain better grinding function of CMP polishing pads, the particle size, sharpness and arrangement pattern (Pattern) and spacing of diamond particles on the tool are modified. (Pitch) and exposure height (Protrusion height) etc. need to be properly planned and configured. [0003] There are many technologies for regularly arranging or evenly distributing diamond particles and other abrasive particles on a substrate according to a pre-planned plan. For example, Chinese Taiwan patent I286097 discloses a grinding tool and its manufacturing method. The structure of the grinding tool includes a substrate , ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B24D3/00C09K3/14
Inventor 宋健民陈盈同
Owner HONGIA INDUSTRY CO LTD