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Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

A semiconductor and wafer platform technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, instruments, etc.

Active Publication Date: 2010-10-13
ESEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This often has the consequence that the conversion of object coordinates determined in the coordinate system of the first camera or in the coordinate system of the second camera into motion coordinates for the pick-and-place system is no longer as precise as required

Method used

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  • Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
  • Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
  • Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

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Embodiment Construction

[0019] figure 1 A top view of a mounting device for mounting semiconductor chips, which is a so-called die bonder, is schematically shown to the extent necessary for understanding the present invention. figure 2 Shows a side view of a partially mounted device. The die bonder includes a wafer stage 1 on which semiconductor chips 2 to be mounted is provided, a substrate stage 3 on which a transport device ( (not shown) provided with a substrate 4 to be mounted, the pick-and-place system 5 removes the semiconductor chip 2 from the wafer stage 1 and places it on the substrate 4 . The pick-and-place system 5 includes an exchangeable chip holder 9 ( figure 2 ) of the bond head 8 and two linear position control drives for moving the bond head 8 in two orthogonal directions designated as x-direction and y-direction. A third drive (not shown) serves to raise or lower the bond head 8 or the chip holder 9 in the z-direction, which extends perpendicularly to the plane of the drawing....

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Abstract

The invention relates to a method for picking up semiconductor chips (2) from a wafer table (1) and mounting them on a substrate (4) by means of a pick-and-place system (5). The position and orientation of the semiconductor chip (2) to be mounted next are determined by means of a first camera (6) and made available in the form of positional data relating to a first system of coordinates (KS1). The position and orientation of the substrate place on which the semiconductor chip (2) will be mounted are determined by means of a second camera (7) and made available in the form of positional data relating to a second system of coordinates (KS2). The conversion of coordinates of the first and second systems of coordinates into coordinates of motion of the pick-and-place system (5) occurs by means of two fixed mapping functions (F, G) and two changeable correction vectors (K1, K2). The correction vectors (K1, K2) are readjusted on the occurrence of a predetermined event.

Description

technical field [0001] The invention relates to a method mentioned in the preamble of claim 1 for picking up semiconductor chips provided on a wafer stage. The invention further relates to a method for mounting a removed semiconductor chip onto a substrate. Background technique [0002] Mounting equipment used to mount semiconductor chips is known in the art as a die bonder. The mounting apparatus is used to mount a plurality of identical chips in a wafer adjacent to each other on a chip carrier one by one on a substrate, for example on a metal lead frame. The die bonder includes a wafer stage on which the chip carrier is located; a transport system for providing a substrate; and a pick and place system for placing semiconductor chips from The chip carrier is removed and placed on the substrate. The pick and place system includes a bond head with a die holder that is moved back and forth by a drive system. The chip holder is rotatable about a vertical axis so that the ro...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/68H01L21/66G05B19/401
CPCH01L21/67144H01L21/681
Inventor 斯特凡·贝勒帕特里克·布莱辛
Owner ESEC
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