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Solder Cable Construction

A solder, conductive cable technology, used in the field of components

Active Publication Date: 2015-09-02
怡德乐纳斯公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] While the use of solder paste is effective in some applications, there are many applications where an improved solder structure is needed and desired due to the orientation of the solder etc. in the application

Method used

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Examples

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Embodiment Construction

[0025] figure 1 is a perspective view of the solder structure 100 according to the first embodiment. The solder structure 100 is a two-layer structure, wherein the solder structure 100 includes an inner cable 110 (inner part) and a solder body 120 surrounding the inner cable 110 and representing the outer part.

[0026] The inner cable 110 is in the form of an elongated cable formed of a conductive material such as copper. The solder body 120 is formed around the inner wire 110 such that it surrounds the inner wire 110 . Solder body 120 may have any number of different shapes and sizes. For example, the solder body 120 is depicted as taking the form of a cylinder (however, other shapes such as oval, square, triangular, etc. are possible). In this two-layer structure, the inner wire 110 is the inner part and the solder body 120 is the outer part. Thus, the inner cable 110 represents a framework or additional support structure for the solder structure 100 . This additional ...

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PUM

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Abstract

A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of US Provisional Application No. 61 / 018,801, filed January 3, 2008, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to the field of components for bonding connectors or other electrical components to each other, and more particularly to solders for facilitating the soldering of a first electronic device, such as a connector, to a second electronic device, such as a printed circuit board Cable structure. Background technique [0004] It is often necessary and desirable to electrically connect one component to another. For example, multi-terminal components such as connectors are often electrically connected to a substrate (e.g., a printed circuit board) such that the terminals of the component are securely attached to contact pads formed on the substrate to provide electrical connections between them. connect. A pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K31/02H01L23/52
CPCB23K3/087H05K2201/10424H05K3/3478Y10T29/49144B23K2201/38H05K2201/10287H05K3/366H05K2203/0415H05K1/142H05K3/3405H01L2224/48137B23K2101/38
Inventor J·赛德勒J·R·扎诺利J·S·卡齐纳
Owner 怡德乐纳斯公司