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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., can solve the problems of inconvenience, general products and methods without suitable structures and methods, etc.

Active Publication Date: 2012-12-12
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This shows that the above-mentioned existing circuit board obviously still has inconvenience and defects in product structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0058] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the circuit board proposed according to the present invention and its manufacturing method its specific implementation, structure, method, Steps, features and effects thereof are described in detail below.

[0059] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, when the technical means and effects adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the attached drawings are only for reference and description, and are not used to explain the present ...

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Abstract

The invention relates to a circuit board and a manufacturing method thereof. The circuit board comprises an insulating layer, a cavity shell and at least one circuit layer, wherein the insulating layer is provided with an outer surface and a plurality of holes on the outer surface; the cavity shell is buried in the insulating layer and surrounds a chamber; the cavity shell is provided with a plurality of openings which are communicated with the chamber; the openings are directly communicated with the holes respectively; and the circuit board is arranged on the outer surface.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board with a chamber and a manufacturing method thereof. Background technique [0002] With the advancement of technology and the advent of mobile phones, people can easily communicate with each other, enabling modern people to enjoy the convenience of communication at any time. Therefore, mobile phones have become an indispensable tool for modern people. [0003] A mobile phone usually includes a circuit board and a speaker (Speaker, also known as a horn). The circuit board has an upper surface and a lower surface opposite to each other, and the speaker is mounted on the upper surface. When the mobile phone plays ringtones or music through the speaker, the speaker will emit sound in a direction away from the circuit board. [0004] It can be seen from this that the sound of the speaker is directly emitted from the upper surface rather than directl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00H04R1/00
Inventor 黄瀚霈
Owner UNIMICRON TECH CORP