Chip package and fabrication method thereof
一种芯片封装、制造方法的技术，应用在半导体/固态器件制造、电固体器件、半导体器件等方向，能够解决降低指纹辨识率等问题
Active Publication Date: 2011-04-27
XINTEC INC
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Problems solved by technology
[0003] However, because the traditional chip package will form bumps of the sealing material at the wire bonding, the surface of the traditional chip package is concave-convex. When it is applied to a fingerprint reader, the concave-convex surface of the chip package will reduce fingerprint identification. Rate
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[0021] Hereinafter, the present invention will be described in detail with examples and accompanying drawings. In the drawings or the description of the description, the same reference numerals are used for similar or identical parts. And in the accompanying drawings, the shape or thickness of the embodiments may be enlarged to simplify or facilitate labeling. Furthermore, the parts of the components in the drawings will be described by description. It should be noted that the components not shown or described in the drawings are forms known to those of ordinary skill in the art. In addition, the specific embodiment is only to disclose the specific mode used in the present invention, and it is not intended to limit the present invention.
[0022] The present invention is illustrated by an embodiment of manufacturing a sensor package, especially a chip package used in a fingerprint reader. However, it can be understood that, in the embodiment of the chip package of the present...
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A chip package and a fabrication method thereof are provided. The chip package comprises a semiconductor substrate, having a first surface and an opposite second surface, wherein the semiconductor substrate contains a semiconductor component and a conductive pad disposed on the first surface. A through hole extends from the second surface of the semiconductor substrate to the conductive pad and communicates with the conductive pad. A redistribution layer is disposed under the second surface of the semiconductor substrate and electrically connected to the conductive pad in the through hole, wherein an edge of the redistribution layer is exposed at a sidewall of the semiconductor substrate. Then, a conductive trace layer is disposed below the redistribution layer, extending to the sidewall of the semiconductor substrate to electrically contact with the redistribution layer.
Description
technical field [0001] The invention relates to a chip package, in particular to a chip package with a via hole and a redistribution circuit stacking layer and a manufacturing method thereof. Background technique [0002] The traditional chip packaging technology is to stick the chip on the printed circuit board, and then use the wire bonding method to electrically connect the chip and the printed circuit board, and finally use the sealing material to cover the wire bonding to form the chip package. [0003] However, because the traditional chip package will form bumps of the sealing material at the wire bonding, the surface of the traditional chip package is concave-convex. When it is applied to a fingerprint reader, the concave-convex surface of the chip package will reduce fingerprint recognition. Rate. [0004] Therefore, the industry urgently needs a chip package, which can make the chip package have a flat surface. Contents of the invention [0005] To solve the ab...
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IPC IPC(8): H01L23/485H01L21/60
CPCH01L2221/68372H01L2924/01013H01L2924/01082H01L2924/01075H01L2924/01033H01L2224/11849H01L24/32H01L24/03H01L2924/014H01L2224/0236H01L21/6835H01L2924/01029H01L2924/01006H01L2224/02381H01L2924/01019H01L2224/02377H01L2224/13024H01L2224/03002H01L2224/131H01L2224/0401H01L2924/14H01L2924/1461H01L2924/15788H01L2924/00
Inventor 刘建宏
Owner XINTEC INC