Method for plating gold on equilong connecting fingers

Abstract

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) manufacturing intra-board patterns and equilong connecting finger patterns on the surface of a printed circuit board (PCB); (2) depositing a 0.3-0.8mu m thick copper layer on the surface of the whole PCB; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) removing the deposited copper layer on the connecting fingers by a microetching method; (5) utilizing the residual deposited copper layer as the gold-plating lead to plate gold on the equilong connecting fingers; (6) removing the residual deposited copper layer by resistance welding and microetching methods; and (7) trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting fingers on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed so that the residues of the gold-plating leads are left on the board or the gold-plating leads are excessively removed so that the copper at the tips of the connecting fingers is exposed.

Description

Technical field [0001] The invention relates to a gold plating method for equal length gold fingers. Background technique [0002] In the process of making equal-length gold fingers and gold-plating equal-length gold fingers, the method used in the prior art is to first etch the in-board graphics and gold-plated wires through external images and external etching, and then use solder mask ink to cover the non-gold-plated area , Gold-plated through gold-plated wires, and finally the shape is trimmed, the gold-plated wires are mechanically removed and chamfered, and the chamfers are used to facilitate insertion into the slot. [0003] In this way, gold-plated wires with varying widths of 8-18 mil are drawn from the end of the gold finger of equal length. As the conductive layer of the gold-plated finger, the gold-plated wire is actually a kind of process auxiliary line. It is not in the final product. Retained; after the gold plating, the gold-plated wire is removed by the V engravin...

AI Technical Summary

Problems solved by technology

[0003] This method uses gold-plated wires with different widths of 8-18mil from the end of the equal-length gold finger. As the conductive layer of the gold-plated finger, the gold-plated wire is actually a process auxiliary line, and it is not used in the final product. Retained; after the gold plating is finished, the gold-plated wire is removed by V engraving method after trimming the shape. Due to the precision problem of the mechanical removal method, the gold-plated wire is not removed cleanly and it remains on the board, or the gold-plated wire is excessively removed. The exposed copper on the finger tip leads to hidden dangers in the long-term use of the golden finger area of ​​the product

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