Method for plating gold on equilong fingers

Abstract

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides, equilong connecting finger patterns and leads for gold plating in the board on the PCB; (2) sticking an anti-plating adhesive tape to the non-gold plating area; (3) utilizing the leads for gold plating in the board as the gold-plating leads to plate gold on the equilong connecting fingers; (4) tearing off the anti-plating adhesive tape; (5) coating a protective dry film on the PCB and exposing the leads for gold plating in the board; (6) etching off the leads for gold plating in the board; (7) removing the protective dry film on the PCB; and (8) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting fingers on the PCB and are unnecessary to be removed, thus avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed so that the residues of the gold-plating leads are left on the board or the gold-plating leads are excessively removed so that the copper at the tips of the connecting fingers is exposed.

Description

technical field [0001] The invention relates to a gold-plating method for equal-length gold fingers. Background technique [0002] In the process of making equal-length gold fingers and gold-plating equal-length gold fingers, the method adopted in the prior art is to first etch out the graphics and gold-plated wires in the board through external drawing and external etching, and then use solder resist ink to cover the non-gold-plated area , gold-plated through gold-plated wires, and finally the shape is trimmed, the gold-plated wires are mechanically removed and chamfered, and the chamfers are used to facilitate insertion into the slot. [0003] This method uses gold-plated wires with different widths of 8-18mil from the end of the equal-length gold finger. As the conductive layer of the gold-plated finger, the gold-plated wire is actually a process auxiliary line, and it is not used in the final product. Retained; after the gold plating is finished, the gold-plated wire is...

AI Technical Summary

Problems solved by technology

[0003] This method uses gold-plated wires with different widths of 8-18mil from the end of the equal-length gold finger. As the conductive layer of the gold-plated finger, the gold-plated wire is actually a process auxiliary line, and it is not used in the final product. Retained; after the gold plating is finished, the gold-plated wire is removed by V engraving method after trimming the shape. Due to the precision problem of the mechanical removal method, the gold-plated wire is not removed cleanly and it remains on the board, or the gold-plated wire is excessively removed. The exposed copper on the finger tip leads to hidden dangers in the long-term use of the golden finger area of ​​the product

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