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Manufacture method for wiring board and stitch arrangement device

A wiring substrate and a manufacturing method technology, which are applied in the manufacture of semiconductor/solid-state devices, the formation of electrical connection of printed components, and the electrical connection of printed components, etc., can solve the problem of long-term, inability to sufficiently improve the manufacturing efficiency of wiring substrates such as PGA and other pin erection. problem, to achieve the effect of improving manufacturing efficiency and pin insertion efficiency

Active Publication Date: 2011-06-15
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method also has the problem that it takes a long time to insert the front end of the stitch into all the through holes of the stitch erecting tool.
[0007] As a result, in the above-mentioned prior art, it is not possible to sufficiently improve the manufacturing efficiency of wiring boards with upright pins such as PGAs.

Method used

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  • Manufacture method for wiring board and stitch arrangement device
  • Manufacture method for wiring board and stitch arrangement device
  • Manufacture method for wiring board and stitch arrangement device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0042] Figure 1 ~ Figure 7 It is a process drawing which shows the manufacturing method of the wiring board in 1st Embodiment. In addition, Figure 1 ~ Figure 7 Shows the longitudinal cross section of the assembly in each process.

[0043] First, like figure 1 As shown, the preparation pins are inserted into the substrate 11. The stitch insertion substrate 11 has a structure in which a plurality of stitch insertion holes 11C are formed to penetrate from the main surface 11A side toward the back surface 11B side in the thickness direction. In addition, the stitch insertion opening on the main surface 11A side of the stitch insertion hole 11C is chamfered to form an inclined surface 11D that expands outward. In addition, the chamfer on the pin insertion port makes it easy to insert a plurality of pins to be inserted later into the pin insertion hole 11C.

[0044] In addition, the stitch 15 is composed of a tip portion 151 and a base end portion 152, and the diameter (outer diamete...

no. 2 Embodiment approach

[0064] Figure 9~Figure 11 It is a process drawing which shows the manufacturing method of the wiring board of 2nd Embodiment. In addition, Figure 9~Figure 11 Shows the longitudinal cross section of the assembly in each process.

[0065] In addition, in this embodiment, only the production method of the stitch wiring board is different, and the other steps are the same as those in the first embodiment. Therefore, in this embodiment, the explanation is focused on the production method of the stitch wiring board. In addition, similar or identical constituent elements are indicated by the same reference numerals.

[0066] First, as in the first embodiment, the stitch insertion board 11 is prepared. Then, like Picture 9 As shown, on the main surface 11A of the stitch insertion substrate 11, the mask member 13 having the opening 13A is arranged so that the opening 13A and the stitch insertion hole 11C coincide. In addition, on the main surface 11A of the pin insertion substrate 11, ...

no. 3 Embodiment approach

[0085] Figure 12 ~ Figure 14 It is a process drawing which shows the manufacturing method of the wiring board of 3rd Embodiment. In addition, Figure 12 ~ Figure 14 Shows the longitudinal cross section of the assembly in each process.

[0086] In addition, in this embodiment, the method of connecting the pin layout substrate and the wiring substrate is different, and the method of manufacturing the pin wiring substrate is the same as that of the first or second embodiment. Therefore, in this embodiment, the pin wiring substrate and the wiring substrate The connection method of the center is explained. In addition, similar or identical constituent elements are indicated by the same reference numerals.

[0087] According to the first embodiment or the second embodiment, after the stitch arrangement substrate 19 is produced, as Picture 12 As shown, the pin array substrate 19 and the wiring substrate 21 formed with a plurality of connecting portions 21A are inserted into the pin i...

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PUM

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Abstract

The invention provides a manufacture method for a wiring board and a stitch arrangement device, which are capable of manufacturing a wiring board with stitches vertically disposed such as PGA in high efficiency. A plurality of stitch inserting holes are formed thorough in a thickness direction and the stitch inserting holes at a main surface side forms an opening after chamfering, the stitches inserting the board at a preset inclining angle relative to a horizontal direction, and a plurality of stitches are held on the main surface via holding components. Then, an air exhaust operation is performed at a back surface side of the stitches inserting into the board, making the stitches inserting holes become negative pressure, and making the holding components move in a preset direction on the main surface, the plurality of stitches are inserted into the plurality of stitch inserting holes, thereby manufacturing the stitch arrangement device. Then, ends of the plurality of stitches protruding from the plurality of stitch inserting holes of the stitch arrangement board are respectively connected with a plurality of connection parts of the wiring board, the plurality of stitches are transmitted from the plurality of stitch inserting holes of the stitch arrangement board to the connection parts of the wiring board.

Description

Technical field [0001] The invention relates to a method for manufacturing a wiring substrate and a pin arrangement device. Background technique [0002] When manufacturing wiring boards such as PGA (pin grid array), a pin erecting tool is used for inserting pins into the pin connection portions of the wiring board to connect them. This stitch erection tool has a structure in which a plurality of through holes are formed in a plate-shaped member, and stitches are inserted into these through holes. The stitch is composed of a tip and a base. The tip of the stitch is inserted into the through hole, and the base is exposed outward. [0003] Then, the position of the above-mentioned pin erecting tool and the wiring board are aligned, and the base end protruding from the pin erecting tool is inserted into and connected to the connecting portion of the wiring board, thereby manufacturing a wiring board such as PGA with pins erected. In addition, the front ends of the pins inserted into...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/00H05K1/11H05K3/40
Inventor 今西明广
Owner NGK SPARK PLUG CO LTD