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Flip chip overmold package

A package and package substrate technology, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve the problems of package deformation, thermal expansion coefficient mismatch, etc.

Active Publication Date: 2014-07-02
ALTERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A more common problem in IC packaging is package deformation due to mismatch in the coefficient of thermal expansion (CTE) and poor bonding between the lid and body of the package
Fitting more decoupling capacitors into a single IC package also becomes more challenging due to increased power requirements

Method used

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  • Flip chip overmold package
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Examples

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Embodiment Construction

[0017] The following embodiments describe methods and apparatus for packaging integrated circuits. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0018] Embodiments described herein provide techniques for reducing package deformation and improving adhesion of the lid to the package body. At the same time, more space is created in the package for placing decoupling capacitors without increasing the size of the overall IC package. Decoupling capacitors are required in integrated circuit (IC) packages because they provide power supply filtering. Decoupling capacitors are used to provide or control instantaneous current in a more timely manner than that provided by active power circuits. Therefore, more decoupling capacitors are requir...

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PUM

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Abstract

The present invention provides an integrated circuit (IC) package having a packaging substrate, an IC disposed on the packaging substrate, and a rigid support member attached to a substrate layer by an adhesive spacer. The package substrate includes a plurality of decoupling capacitors positioned thereon around the IC. A heat sink is placed above the IC. The rigid support member provides enhanced structural support for the IC package, and there is sufficient space between the bottom surface of the rigid support member and the package substrate to allow placement of decoupling capacitors beneath the rigid support member.

Description

Background technique [0001] Integrated circuits (ICs) are at the heart of nearly all modern digital systems. As the use of semiconductor devices becomes more common, more and more demands are placed on chips. The challenge is therefore to have more processing power in a single IC package to meet consumer demand. [0002] This challenge has been met by making devices smaller and smaller. In other words, devices get even smaller as processing power increases. This inevitably creates many opportunities related to the packaging of these components. A more common problem in IC packaging is package deformation due to mismatch in coefficient of thermal expansion (CTE) and poor bonding between the lid and body of the package. Fitting more decoupling capacitors into a single IC package also becomes more challenging as the need for power increases. [0003] Therefore, it would be highly desirable to have a device in a mechanically stable package with sufficient space for placement ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28H01L23/02
CPCH01L23/562H01L2224/32245H01L2924/15311H01L21/565H01L2224/32225H01L23/42H01L2224/73253H01L2924/19105H01L2924/15331H01L23/4334H01L2224/16225H01L2924/3511H01L23/3128H01L2924/19041H01L2924/00014H01L2924/00011H01L2924/1815H01L2224/0401H01L25/165H01L25/50
Inventor K·德圭
Owner ALTERA CORP