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Wireless communication module

A wireless communication module and one-sided technology, applied in the field of mobile communication, can solve the problems of thick thickness, inability to meet flexible applications, and large volume, and achieve the effect of thin thickness, light weight and small volume

Inactive Publication Date: 2011-10-12
NATIONZ TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a new module for mobile terminals, so as to improve the problems that the current mobile communication modules are large in size and thick in thickness, unable to meet the requirements of flexible applications and ultra-thin handheld mobile products

Method used

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Embodiment Construction

[0034] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0035] The wireless communication module of this embodiment is an EVDO mobile communication module, and the aspect ratio of this module is 5:3, adopts the circuit board of BGA package, and this circuit board adopts 6 layers of epoxy glass fiber board circuit board structure, and electronic components are placed on both sides , and adopts 2+2+2 stacking structure for design, the components are all in the form of SMD (Surface Mounted Device, surface mount device), which is convenient for mass production, improves production efficiency, and saves production costs. The top layer adopts a unique shielding cover design , improving the EMC (Electromagnetic Compatibility, Electromagnetic Compatibility) performance of the pro...

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Abstract

The invention belongs to the field of mobile communication, and relates to a wireless communication module, in particular to a high-performance small-sized module of a code division multiple access (CDMA) evolution-data optimized (EV-DO) mobile terminal. The small-sized module is applicable to a third generation (3G) user terminal. The wireless communication module is characterized in that: board-level connection is carried out by ball grid array (BGA) package; the level of integration is high; the size is small; good electrical performance and an external interface function are realized; and requirements of a customer can be well met. The wireless communication module comprises a radio frequency front end, a transmitting and receiving channel, a base band processing part, a memory and a power manager, wherein the base band processing part and the radio frequency front end are placed on a top layer of a circuit board; a shielding cover is arranged on the top layer to guarantee an excellent electromagnetic compatibility function of the module; the memory is placed on a bottom layer of the circuit board; and the bottom layer adopts an advanced BGA technology to guarantee reliable connection during the application of the module.

Description

technical field [0001] The invention belongs to the field of mobile communication and relates to a wireless communication module, in particular to a terminal module based on a CDMA2000 mobile communication system. Background technique [0002] With the development of mobile communication technology, users have higher and higher requirements for personal communication, mobile communication has also developed from 2G and 2.5G to 3G, and the application of mobile terminals is becoming more and more extensive. [0003] The CDMA2000 (Code Division Multiple Access 2000, Code Division Multiple Access) 1x EV-DO standard originated from the HDR (high data rate, high-speed data transmission) technology of Qualcomm in the United States. After that, it was continuously improved and tested in March 2000. The name of CDMA2000 1x EV-DO submitted a formal technical proposal to 3GPP2 (3rd Generation Partnership Project 2, 3rd Generation Partnership Project 2). 1xEV means "Evolution", which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40H04W88/02
Inventor 徐兴福王鹏宋玉喜李勇强徐振
Owner NATIONZ TECH INC
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