Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit device

A circuit device and circuit technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, and can solve the problems of unfavorable size reduction of the inner package substrate 100 and position occupation of bonding components, etc.

Inactive Publication Date: 2012-03-21
RICHWAVE TECH CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] so, such as figure 1 The power / ground bonding selection structure adopted in the integrated circuit device 300 as shown may not be conducive to the reduction of the size of the package substrate 100 therein and may cause the position occupancy of the bonding members thereon.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit device
  • Circuit device
  • Circuit device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Please refer to the following and cooperate Figure 2-Figure 3 The accompanying drawings are to illustrate the implementation of the present invention.

[0034] Please refer to figure 2 , shows a schematic situation of an integrated circuit device 500 with a power / ground junction selection structure according to an embodiment of the present invention.

[0035] Such as figure 2 As shown, viewed from above, the integrated circuit device 500 includes a packaging substrate 600 and a circuit device 700 located on a part of the packaging substrate 600 . Here, the circuit device 700 may be disposed on a part of the packaging substrate 600 through a packaging process such as surface mount technology (SMT).

[0036]In one embodiment, the circuit device 700 is, for example, a semiconductor chip formed from a silicon wafer, and several bonding pads (bonding pads) separated from each other are provided at different positions along the edge of the top surface of the circuit dev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a circuit device, which comprises a selection pad, a first power connecting pad and a first grounding pad, wherein the selection pad, the first power connecting pad and the first grounding pad are positioned in the different places of a top surface of the circuit equipment; the selection pad is coupled with one of the first power connecting pad and the first grounding pad by a welded wire, thereby determining the function of the circuit equipment.

Description

technical field [0001] The present invention relates to the fabrication of integrated circuits, and more particularly to a circuit arrangement having a bonding option structure. Background technique [0002] In integrated circuit design, a bonding option structure is generally used to selectively change hardware functions in the integrated circuit. Therefore, the manufacturer can selectively change different hardware conditions such as the internal logic, specification function, and timing of the circuit chip in the integrated circuit device according to the actual application requirements, thereby providing an integrated circuit with a similar hardware architecture but with multiple optional functions. circuit device. [0003] One of the currently used bonding option configuration options is the power / ground bonding option configuration. Please refer to figure 1 , which shows a schematic situation of a conventional integrated circuit device 300 using a power / ground (powe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/00H01L23/488
CPCH01L2224/4813H01L2224/49171
Inventor 陈则朋
Owner RICHWAVE TECH CORP