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Back drilling method of PCB (Printed Circuit Board)

A processing method and back-drilling technology, which is applied in the field of PCB back-drilling, can solve the problems of increased processing difficulty, a large number of copper wires, easy blockage of through holes, etc., and achieve the effect of reducing the risk of hole plugging

Active Publication Date: 2013-09-25
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing back-drilling of PCB boards, the through-holes are electroplated to the target copper thickness before back-drilling, but after the through-holes are electroplated, the copper thickness in the holes is high, and a large number of copper wires are prone to occur, making the through-holes easy to block, and for the through-holes When the hole diameter is less than 0.3mm, the processing difficulty increases

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  • Back drilling method of PCB (Printed Circuit Board)

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Embodiment Construction

[0021] like figure 1 Shown, the back-drilling processing method of PCB of the present invention comprises the steps:

[0022] Step 1. Provide a PCB substrate; the PCB substrate is processed by material cutting, dry film pasting, inner layer browning and lamination, and the processing is realized by using the existing technology.

[0023] Step 2, drilling through holes on the PCB substrate.

[0024] Step 3. Copper plating on the whole board. Control the copper thickness in the through hole to 2-15 μm to avoid the phenomenon that the copper in the hole is too thick and a large number of copper wires are generated during back drilling, which will cause the hole to be blocked.

[0025] Step 4. Tinning the entire board, the thickness of the tin plating is 5-10 μm; the tin plating layer can provide corrosion protection for the hole copper and the copper thickness of the substrate surface during etching.

[0026] Step 5. Drilling away part of the copper in the through holes that ne...

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Abstract

The invention provides a back drilling method of a PCB (Printed Circuit Board), which comprises the following steps of: 1: providing a PCB substrate; 2, drilling a through hole to the PCB substrate; 3, plating copper on the whole substrate, controlling the copper thickness in the through hole to be 2-15mu m; 4, plating tin on the whole substrate; 5, drilling part hole copper on the through hole needing back drilling and forming a back drilling hole; 6, carrying out ultrasonic rinsing and high-pressure water washing for removing residual drillings in the back drilling hole; 7, etching residual copper wires in the back drilling hole; and 8, electroplating: electroplating the hole copper to reach requirement. According to the back drilling method of the PCB, provided by the invention, through controlling the copper thickness in the through hole before back drilling and plating copper for two times before and after back drilling, the back drilling copper wires are reduced, and the risk of back drilling hole plugging is decreased, so that the bore diameter of the back drilling hole can be improved within 0.25mm.

Description

technical field [0001] The invention relates to the technical field of PCB back-drilling, in particular to a method for back-drilling PCBs suitable for small-diameter back-drilling. Background technique [0002] Existing back-drilling of PCB boards, the through-holes are electroplated to the target copper thickness before back-drilling, and the copper thickness in the through-holes is high after electroplating, and a large number of copper wires are prone to occur, making the through-holes easy to block, and for the through-holes When the hole diameter is less than 0.3mm, the processing difficulty increases. Contents of the invention [0003] The purpose of the present invention is to provide a PCB back-drilling processing method, which can effectively reduce back-drilling copper wires, reduce the risk of back-drilling and blocking holes, and increase the back-drilling aperture capacity to within 0.25mm. [0004] In order to achieve the above object, the present invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 黄广新唐海波曾志军曾红
Owner DONGGUAN SHENGYI ELECTRONICS