Module integration circuit package structure with electrical shielding function and manufacturing method thereof
An integrated circuit and packaging structure technology, which is applied to the packaging structure of a module integrated circuit with an electrical shielding function and its production field, can solve the problems of cost, economic benefit and industrial utilization reduction, multiple man-hours, etc.
Inactive Publication Date: 2012-05-30
AZUREWAVE TEHNOLOGIES INC
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Problems solved by technology
But this kind of known electromagnetic shielding metal cover must be designed and manufactured according to different modules or devices, so that the known electromagnetic shielding metal cover needs to consume more man-hours, manpower and cost
[0006] In addition, another disadvantage of the above-mentioned known electromagnetic shielding metal cover is that the size, shape, and block of the electronic circuit or device that needs to be used for electromagnetic shielding are different. If it is necessary to manufacture modules with different sizes, shapes, and blocks Molds, stamping processing and step-by-step component packaging make the production of electromagnetic shielding metal covers difficult and cannot be applied to rapid production lines, thus reducing the economic benefits and industrial utilization of known electromagnetic shielding metal covers.
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[0044] see figure 1 , Figure 1A to Figure 1H shown, where figure 1 Be the flow chart of first embodiment making method, Figure 1A , Figure 1C , Figure 1E and Figure 1G A three-dimensional schematic diagram showing the manufacturing process of the first embodiment, Figure 1B , Figure 1D , Figure 1F and Figure 1H shows a schematic cross-sectional view of the manufacturing process of the first embodiment, and Figure 1GIt is a three-dimensional schematic diagram of the finished product of the first embodiment, Figure 1H It is a schematic cross-sectional view of the finished product of the first embodiment. It can be seen from the above figures that the first embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z with an electrical shielding function, which at least includes the following steps (from step S100 to step S110):
[0045] Step S100: First, match figure 1 , Figure 1A and Figure...
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The invention provides a module integration circuit package structure with an electrical shielding function. The structure comprises a substrate unit, an electrical unit, a conductive unit, a packaging unit and a shielding unit. The substrate unit comprises at least a circuit substrate which comprises at least a grounding bonding pad. The electrical unit comprises a plurality of electronic components which are arranged on the circuit substrate and are electrically connected with the circuit substrate. The conductive unit comprises at least a conductive component which is arranged on the circuit substrate, and a first end part of the conductive component is electrically connected to the grounding bonding pad. The packaging unit comprises a packaging colloid which is arranged on the circuit substrate and covers the above electronic components and a part of the conductive component, wherein a second end part of the conductive component is exposed. The shielding unit comprises a metal shielding layer which coats an external surface of the packaging colloid, wherein the metal shielding layer and the second end part of the conductive component are electrically contacted. The invention provides the module integration circuit package structure with the electrical shielding function.
Description
technical field [0001] The invention relates to a package structure of a module integrated circuit (module IC) and a manufacturing method thereof, in particular to a package structure of a module IC with an electrical shielding function and a manufacturing method thereof. Background technique [0002] In recent years, with the rapid development of science and technology, various products are oriented towards the application of technology, and are constantly developing. In addition, due to more and more functions of products, most of the current products are designed in a modular way. However, the integration of multiple modules with different functions in the product can greatly increase the function of the product, but under the current demand for miniaturization and exquisite appearance of the product, how to design a product that is both small in size and multi-functional? Product is the goal that all walks of life are currently researching. [0003] In terms of semicon...
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IPC IPC(8): H01L23/60H01L21/60H01L21/56
CPCH01L23/552H01L24/97H01L2924/14
Inventor 黄忠谔李岳政
Owner AZUREWAVE TEHNOLOGIES INC