Modular integrated circuit packaging structure and manufacturing method thereof
An integrated circuit and packaging structure technology, which is applied to the packaging structure of a module integrated circuit with an electrical shielding function and its manufacturing field, can solve the problems of different sizes, shapes, blocks, consumption, multiple man-hours, etc.
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no. 1 example 〕
[0045] see figure 1 , Figure 1A to Figure 1H shown, where figure 1Be the flow chart of first embodiment making method, Figure 1A , Figure 1C , Figure 1E and Figure 1G A three-dimensional schematic diagram showing the manufacturing process of the first embodiment, Figure 1B , Figure 1D , Figure 1F and Figure 1H shows a schematic cross-sectional view of the manufacturing process of the first embodiment, and Figure 1G It is a three-dimensional schematic diagram of the finished product of the first embodiment, Figure 1H It is a schematic cross-sectional view of the finished product of the first embodiment. As can be seen from the above figures, the first embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z, which at least includes the following steps (from step S100 to step S110):
[0046] Step S100: First, match figure 1 , Figure 1A and Figure 1B ( Figure 1B for Figure 1A As shown...
no. 2 example
[0055] see Figure 2A and Figure 2B shown, where Figure 2A making a flowchart of the method for the second embodiment, and Figure 2A shows a schematic cross-sectional view of the manufacturing process of the second embodiment, and Figure 2B Step (D) in is a schematic cross-sectional view of the finished product in the second embodiment. As can be seen from the above figures, the second embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z, which at least includes the following steps (from step S200 to step S212):
[0056] Step S200: First, match Figure 2A and Figure 2B As shown in step (A), at least one circuit substrate 10 is provided, wherein the circuit substrate 10 has four ground pads 100 .
[0057] Step S202: Next, coordinate Figure 2A and Figure 2B As shown in the step (A), a plurality of electronic components 20 are arranged and electrically connected to the circuit substrate 10 .
[...
no. 3 example
[0066] see Figure 3A and Figure 3B shown, where Figure 3A is a flowchart of the method of making the third embodiment, and Figure 3A shows a schematic cross-sectional view of the manufacturing process of the third embodiment, and Figure 3B Step (D) in is a schematic cross-sectional view of the finished product of the third embodiment. As can be seen from the above figures, the third embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z, which at least includes the following steps (from step S300 to step S312):
[0067] Step S300: First, match Figure 3A and Figure 3B As shown in step (A), at least one circuit substrate 10 is provided, wherein the circuit substrate 10 has four ground pads 100 .
[0068] Step S302: Next, coordinate Figure 3A and Figure 3B As shown in the step (A), a plurality of electronic components 20 are arranged and electrically connected to the circuit substrate 10 .
[00...
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