Printed circuit board and manufacturing method thereof
A technology for printed circuit boards and manufacturing methods, applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., capable of solving problems such as rising inductance, malfunctioning of transistors, preventing transistors from being disconnected, etc.
Active Publication Date: 2015-05-27
IBIDEN CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, if the diameter is extremely reduced, it is expected that the self-inductance will increase
If the self-inductance becomes larger, the impedance will generally become larger
In addition, if the impedance of the via hole for power supply becomes large, the power supply from the IC to the transistor may slow down.
In recent years, the driving frequency of ICs mounted on printed circuit boards has tended to increase, and the time from when a transistor is turned ON to when it is turned on again has become shorter. Therefore, if the power supply to the transistor is insufficient, the transistor may malfunction. Work
In addition, when the impedance of the through-hole for grounding becomes large, the fluctuation of the power supply voltage also becomes large, so the turning off (OFF) operation of the transistor is hindered, and the transistor may malfunction.
Method used
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[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, arrows Z1 and Z2 in the figure respectively indicate the stacking directions of the circuit boards corresponding to the normal direction of the principal surfaces (front and back) of the circuit board (or the thickness direction of the core substrate). On the other hand, arrows X1, X2 and arrows Y1, Y2 indicate directions perpendicular to the stacking direction (directions parallel to the main surface of the circuit board), respectively. The main surface of the circuit board is the X-Y plane. In addition, the side of the circuit board is an X-Z plane or a Y-Z plane.
[0035] In the present embodiment, the two main surfaces facing the opposite stacking directions are referred to as a first surface (surface on the arrow Z1 side) and a second surface (surface on the arrow Z2 side). In the stacking direction, the side close to the core is referred to ...
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Abstract
A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.
Description
technical field [0001] The present invention relates to printed circuit boards and methods of manufacturing the same. Background technique [0002] Patent Document 1 discloses a printed circuit board having through holes having different widths. The large-diameter vias can be used for power supply or grounding, for example, and the small-diameter vias can be used for transmitting signals, for example. [0003] Patent Document 1: Japanese Patent Application Publication No. 2007-88202 [0004] In the printed wiring board described in Patent Document 1, it is difficult to uniformly fill resin or conductors simultaneously into through holes having different widths. For example, if filling is carried out under ideal conditions for a large-diameter via hole, the small-diameter via hole may not be completely filled. [0005] Therefore, it is generally considered that the diameter of the through-hole for power supply or grounding is the same as the diameter of the through-hole fo...
Claims
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IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/0263H05K1/115H05K3/0038H05K3/427H05K3/4602H05K2201/09536H05K2201/09563H05K2201/0979H05K2201/09827H05K2203/1572Y10T29/49124
Inventor 石田敦富永亮二郎酒井健二
Owner IBIDEN CO LTD