Electroplating device and electroplating method

An electroplating device and electroplating solution technology, applied in electrolytic components, electrolytic process, cells, etc., can solve the problems of low product yield and large difference in coating thickness
CN102534733AActive Publication Date: 2012-07-04NEW FOUNDER HLDG DEV LLC
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
NEW FOUNDER HLDG DEV LLC
Publication Date
2012-07-04

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Abstract

The invention discloses an electroplating device and an electroplating method, relating to the technical field of electroplating and solving the technical problem that the yield of products is lower due to larger thickness differences on different areas of a plating formed through electroplating by using the traditional electroplating method. The electroplating device comprises a power supply, a container storing an electroplating solution and a power wire regulating device, wherein a metal ion source article as an anode is immersed in the electroplating solution, an article to be plated, as a cathode, is immersed in the electroplating solution, metal ions are attached onto the article to be plated under the action of power wires between the metal ion source article and the article to be plated, and the power wire regulating device is used for regulating the distribution of the power wires from the metal ion source article to the article to be plated. The electroplating method comprises the step of: regulating the distribution of the power wires from the metal ion source article to the article to be plated by using the power wire regulating device so as to attach the metal ions ionized from the metal ion source article to a metal layer of the article to be plated along the power wires to form the plating. The invention is applicable to plating electroplating.
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Description

technical field

[0001] The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating method. Background technique

[0002] Electroplating (English: Electroplating) is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts.

[0003] At present, electroplating methods mainly include gantry electroplating, vertical electroplating and horizontal electroplating according to their process steps and processing equipment. Among them, gantry electroplating is a relatively traditional electroplating method with the advantage of low cost, so it is widely used. For example: In the field of circuit board manufacturing, gantry electroplating is widely used for graphic electroplating.

[0004] Such as figure 1 As shown, the existin...

Claims

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