Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electroplating device and electroplating method

An electroplating device and electroplating solution technology, applied in electrolytic components, electrolytic process, cells, etc., can solve the problems of low product yield and large difference in coating thickness

Active Publication Date: 2012-07-04
NEW FOUNDER HLDG DEV LLC
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The embodiment of the present invention provides an electroplating method and an electroplating device using the electroplating method, which solves the problem that the thickness of the plating layer electroplated by the existing electroplating method has a large difference in different regions, resulting in a low product yield rate. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electroplating device and electroplating method
  • Electroplating device and electroplating method
  • Electroplating device and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Embodiments of the present invention provide an electroplating device and an electroplating method with good uniformity of electroplated coating, high yield and low cost.

[0034] The electroplating device provided by the invention comprises:

[0035] power supply;

[0036] Containers for storing electroplating solutions;

[0037] A metal ion source object as an anode, which is immersed in the electroplating solution and electrically connected to the positive pole of the power supply;

[0038] The object to be plated as the cathode is immersed in the electroplating solution and electrically connected to the negative electrode of the power supply; wherein, metal ions are attached under the action of the electric force line between the metal ion source object and the object to be plated forming a coating on the object to be coated;

[0039] The power line adjusting device is used to adjust the distribution of the power line from the metal ion source object to the objec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electroplating device and an electroplating method, relating to the technical field of electroplating and solving the technical problem that the yield of products is lower due to larger thickness differences on different areas of a plating formed through electroplating by using the traditional electroplating method. The electroplating device comprises a power supply, a container storing an electroplating solution and a power wire regulating device, wherein a metal ion source article as an anode is immersed in the electroplating solution, an article to be plated, as a cathode, is immersed in the electroplating solution, metal ions are attached onto the article to be plated under the action of power wires between the metal ion source article and the article to be plated, and the power wire regulating device is used for regulating the distribution of the power wires from the metal ion source article to the article to be plated. The electroplating method comprises the step of: regulating the distribution of the power wires from the metal ion source article to the article to be plated by using the power wire regulating device so as to attach the metal ions ionized from the metal ion source article to a metal layer of the article to be plated along the power wires to form the plating. The invention is applicable to plating electroplating.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating method. Background technique [0002] Electroplating (English: Electroplating) is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts. [0003] At present, electroplating methods mainly include gantry electroplating, vertical electroplating and horizontal electroplating according to their process steps and processing equipment. Among them, gantry electroplating is a relatively traditional electroplating method with the advantage of low cost, so it is widely used. For example: In the field of circuit board manufacturing, gantry electroplating is widely used for graphic electroplating. [0004] Such as figure 1 As shown, the existin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D17/00C25D21/12
Inventor 苏新虹朱兴华
Owner NEW FOUNDER HLDG DEV LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com