Semiconductor device and forming method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD
- Publication Date
- 2020-09-08
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor device and a forming method thereof. Background technique
[0002] Memory, such as dynamic random access memory (Dynamic Random Access Memory, DRAM), which generally includes a storage capacitor and a storage transistor electrically connected to the storage capacitor, the storage capacitor is used to store charges representing stored information, and the storage transistor The storage capacitor can be electrically connected through a node contact.
[0003] Currently, a method for preparing a node contact is, for example, using bit lines and isolation lines to define a node contact window, and then filling the node contact window with a conductive material to form a node contact.
[0004] However, when the bit lines and isolation lines are prepared, the graphic morphology of the bit lines and isolation lines corresponding to the edge positions is easily def...