Miniature fuse

A fuse, a small technology, applied in the manufacture of electrical components, circuits, fuses, etc., can solve the problems of unfavorable breaking capacity, excessive metal vapor, poor fusing capacity, etc., to achieve excellent fusing capacity, reduce arcing, and good breaking capacity Effect

Active Publication Date: 2012-08-01
SEMITEL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has a high melting point and poor fusing ability, and more metal vapor is formed when the high current is fusing, which is not conducive to providing better breaking ability and is prone to arcing.

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0026] Embodiment: A small fuse, as shown in the accompanying drawings, consists of two terminals 8, a substrate 6, a melt 7 and an arc-extinguishing glass layer, the melt is located on the surface of the substrate, and the two terminals 8 are respectively connected to Both ends of the melt are electrically connected, and the arc-extinguishing glass layer covers the surface of the melt. The arc-extinguishing glass layer is an arc-extinguishing glass sheet. The arc-extinguishing glass sheet 1 is composed of lead borosilicate glass. The arc-extinguishing glass The surface of the sheet 1 in contact with the melt has several micro-nano holes 2, and the melt is formed by brushing a conductive paste containing spherical or nearly spherical metal particles through a screen. The conductive paste is composed of a glass phase, an organic carrier It is composed of the metal particle; the metal particle is 80-100 nanometers, and the central area of ​​the metal particle has a hollow area. ...

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Abstract

The invention discloses a miniature fuse, which consists of two wiring terminals, a substrate, a melt and an arc-extinguishing glass layer, wherein the melt is positioned on the surface of a ceramic sheet; the two wiring terminals are respectively electrically connected with the two ends of the melt; the arc-extinguishing glass layer, which covers the surface of the melt, is an arc-extinguishing glass sheet which consists of borosilicate lead glass; a plurality of micro-nano holes are formed on the surface of the arc-extinguishing glass sheet, which is contact with the melt; the melt is formed by electric conductive paste containing spherical or approximately-spherical metal particles through screen printing; the metal particles are 80 to 100 nm in diameter; hollow areas are arranged in the central areas in the metal particles; the micro-nano holes are 20 to 500 nm in diameter; the intervals between adjacent micro-nano holes are one to five times of the hole diameters of the micro-nano holes; and the hole depths of the micro-nano holes are one to 10 times of the hole diameters. The miniature fuse disclosed by the invention can effectively avoid the phenomenon of arc discharge and provides high insulation impedance.

Description

technical field [0001] The invention relates to the technical field of fuses, in particular to a small fuse. Background technique [0002] As electronic products are becoming more and more miniaturized, fuses used as circuit protection are also developing in the direction of small size. Not only that, because the fuse is an original component used to protect the circuit, it is also required to have high reliability in many occasions, which puts forward higher requirements for the design of the fuse in all aspects. [0003] There are many ways to form the fuse of the fuse (1) prepare the alloy, pull the alloy into a wire, (2) prepare the metal powder into a slurry, and print it on the substrate by the silk screen process, (3) use the method of vacuum sputtering Metal is sputtered onto the substrate. [0004] Usually, the materials used to prepare the fuse are various metal powders (usually spherical or nearly spherical), which are mixed with polymer materials and then prepa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H85/05H01H85/38H01H85/06H01H69/02
Inventor 龚建张甦冯波
Owner SEMITEL ELECTRONICS
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