14 results about "Lead glass" patented technology

The conductive paste provided by this invention comprises a conductive metal, lead-free glass powder, and an organic binder. The conductive metal and the lead-free glass powder constitute the total solids content, wherein the content of the conductive metal in the total solids content is 75-99.8 wt%, and the content of the lead-free glass powder is 0.2-25 wt%. The lead-free glass powder is a Te-Bi oxide system, which includes tellurium oxide and bismuth oxide. Tellurium oxide, as a glass network former, mainly determines the softening point and fluidity of the glass, effectively reducing the melting point and imparting good fluidity. Bismuth oxide, as a network modifier, can regulate the chemical activity of the glass, allowing it to moderately corrode the passivation layer during sintering and promoting the formation of silver-silicon ohmic contacts. Adjusting the ratio of the two within this range allows for precise matching of the sintering temperature curves of different crystalline silicon solar cells, broadening the process window for lead-free glass. Furthermore, this invention also provides a method for preparing the conductive paste.

This invention provides a solar cell, its fabrication process, a tandem solar cell, and a photovoltaic module. The fabrication process of the solar cell includes: providing a cell substrate; printing a conductive material onto the cell substrate; and curing the conductive material to form initial grid lines. The conductive material includes bismuth-based lead-free glass; the conductive material also includes copper powder and nickel powder; the mass ratio of copper powder to nickel powder is 80~99.5:0.5~20, and the copper powder includes flake-shaped copper powder and spherical copper powder. In the fabrication process of this invention, the conductive material, through a ternary synergistic system of "copper-nickel-glass" and a dual-morphology copper powder composite design, achieves multiple effects such as suppressing copper diffusion and oxidation and improving adhesion under an air-sintering atmosphere, thereby improving the fill factor and photoelectric conversion efficiency of the solar cell.

The utility model discloses a stress buffer structure of leadless glass ring seal joint of titanium cup mouth part, including the mechanism that holds, the mechanism that holds includes titanium cup, the top of titanium cup is provided with annular wave groove, the inside wall of annular wave groove has sprayed transition coating, the top of titanium cup is equipped with glass ring, glass ring bottom is compatible with annular wave groove. In the utility model, the annular wave groove is formed through precision numerical control processing or laser etching at the cup mouth position of titanium cup, then the transition coating of silicon oxide is plated on the inside wall of annular wave groove by using chemical vapor deposition, then the molten glass ring is buckled on the top of annular wave groove, thereby completing the sealing operation, in the whole sealing process, annular wave groove prevents stress concentration, then the transition coating guarantees the wettability of glass melting and titanium, effectively buffers stress, and the product quality is stable.

The invention discloses lead-free glass powder for passivation of mesa type semiconductors and application of the lead-free glass powder, the lead-free glass powder comprises base material powder and crystal substance and / or quartz glass powder, the base material powder comprises, by weight, 35%-55% of ZnO, 0-10% of B2O3, 25%-40% of SiO2, 5%-40% of Y2O3, 0.01%-10% of RO and 0.01%-5% of RxOy, RO is at least one of CaO, BaO, MgO and SrO, and RxOy is at least one of SnO2, In2O3, ZrO2, TiO2, Bi2O3, La2O3, Nd2O3, GeO2, CeO2 and MnO2; the crystal substance is at least one of ZnO, ZnOB2O3, 2ZnOSiO2, 3ZnOB2O3, 4ZnOB2O3 and 2MgO. 2Al2O3. 5SiO2, relative to 100 g of the base material powder, the dosage of the crystal substance is 0.01-10 g, and the dosage of the quartz glass powder is 0-5 g. By increasing the content of SiO2 in the glass powder, the acid resistance of the material is improved. The stable and uniform glass is obtained by reducing the main component ZnO, reducing B2O3, increasing the content of Y2O3 and adding RO to generate a synergistic effect.

The application discloses a conductive silver paste for photovoltaic cells and a preparation method thereof. The conductive silver paste comprises the following raw materials in percentage: 65-85% of silver powder and 1-3% of modified binder, and the rest is an organic carrier. In the printing process of the conductive silver paste, the substances in the organic carrier contact the silver powder, so that the silver chelate in the organic carrier is fully contacted, and then a stable conductive path can be formed during baking. The modified binder is a lead-free glass formed by taking bismuth trioxide as a main raw material to form a bismuth-based glass. The addition of calcium fluoride in the raw material can reduce the water absorption of the bismuth-based glass, thereby ensuring the stability of the resistivity. The addition of titanium dioxide can exist in a quadruple coordination form, so that the Si-O-Si bond in the glass is changed into a Si-O-Ti bond, thereby forming an interconnected tetrahedral structure, increasing the network connectivity of the glass, and simultaneously increasing the antireflection effect of the glass and the utilization rate of light energy.

Disclosed is a thick film resistor paste which, while using a lead borosilicate glass as an insulating material, has no appearance crack abnormality and has sufficient surge resistance, a thick film resistor body using the thick film resistor paste, and an electronic component provided with the thick film resistor body. The thick film resistor paste contains a ruthenium oxide-containing glass powder and an organic vehicle. The ruthenium oxide-containing glass powder contains 10 mass% or more and 60 mass% or less of ruthenium oxide. In the glass composition, 60 mass% or less of silicon oxide, 30 mass% or more and 90 mass% or less of lead oxide, and 5 mass% or more and 50 mass% or less of boron oxide are contained with respect to 100 mass% of the glass components. The total content of the silicon oxide, the lead oxide, and the boron oxide is 50 mass% or more with respect to 100 mass% of the glass components.

This invention relates to the field of medical device technology, specifically to a convenient medical isolation screen, comprising a main frame, on which a movable support module, a protective module, and a lifting linkage module are mounted. The movable support module is installed at the bottom of the main frame, and the lifting linkage module is located in the middle of the main frame. The protective module includes a lead glass protective screen, a wraparound lead apron, and operating holes for the lead apron sleeves. The lead glass protective screen is fixedly connected to the bottom of the main frame. The operating holes for the lead apron sleeves are symmetrically located on both sides of the main frame below the lead glass protective screen. The wraparound lead apron covers the perimeter of the operating side of the main frame. The lifting linkage module is signal-connected to a control module, which controls the lifting linkage module, thereby simultaneously driving the lead glass protective screen and the wraparound lead apron to rise and fall synchronously. This invention aims to reduce the radiation dose and physical exertion of medical personnel, and solves the technical defects of existing isolation screens, such as insufficient protection and cumbersome operation.

This invention discloses the composition and preparation of an aluminum electrode for a positive temperature coefficient thermistor, belonging to the field of chemical preparation. The aluminum electrode paste is composed of near-spherical aluminum powder, lead-free environmentally friendly glass powder, organic binder, and protective additives. By optimizing the lead-free glass component, the surface protective film of the aluminum powder is prevented from being eroded, thus preventing oxidation and detachment. The aluminum electrode is formed on a barium titanate ceramic substrate through screen printing and sintering at 580–630℃, achieving good ohmic contact with the substrate. The electrode is firmly attached, oxidation-resistant, does not detach, has a small resistance change rate, and exhibits superior corrosion resistance and weather resistance compared to traditional lead-containing aluminum paste. It is suitable for mid-to-high-end PTC thermistors and applications in energy storage and new energy sectors. This invention solves the problems of easy detachment and poor reliability of existing lead-free aluminum pastes, significantly improving component lifespan and stability.

The application discloses a multi-phase stress self-adapting composite sealing paste, a preparation method thereof and a semiconductor packaging structure. The paste comprises 60-75% low-melting-point lead-free glass powder, 8-15% nano metal alloy particles, 3-7% negative thermal expansion compensation phase, 10-15% organic carrier and 0.5-2% modified additive according to mass percentage. The softening point Ts of the nano metal alloy particles is lower than the glass transition temperature Tg of the glass powder, the nano particles are uniformly distributed on the surface of the glass powder and form a micro anchoring structure. In the sealing cooling stage, the Ts-Tg temperature difference gradient is utilized to promote the plastic rheology of the nano particles, and the negative thermal expansion compensation phase is utilized to neutralize the interface residual thermal stress. The preparation method comprises surface modification, vacuum stirring, three-roll grinding and conductivity monitoring. The packaging structure comprises a substrate, a cover plate and a paste sintering sealing layer. The application improves the air tightness and reliability of the semiconductor packaging and is suitable for MEMS sensors and high-power modules.

The utility model relates to the field of ray protection lead glass window, concretely relates to a ray protection lead glass window structure, including front window frame, back window frame, bottom frame, lead glass, first fixed plate, second fixed plate, third fixed plate and fourth fixed plate, and the bottom frame is installed to the front window frame bottom, and the lead glass is placed on the bottom frame, and the lead glass right side is positioned through the first fixed plate, and the lead glass left side is positioned through the second fixed plate, and the lead glass upside is positioned through the third fixed plate, and the back window frame is installed to the front window frame back side, and the lead glass back side is positioned through the fourth fixed plate, and this design can realize the fixation to the lead glass of different sizes through the first fixed plate, the second fixed plate and the third fixed plate, and the operation is simple.

The utility model discloses a LED glass bend curtain relates to glass bend curtain technical field, wherein, mainly include LED film screen, curtain wall structure, curtain wall structure includes glass curtain wall, curtain wall seat, heating component, and the glass curtain wall is located between heating component and LED film screen. Through above -mentioned technical scheme, solved the LED part of LED glass bend curtain in the recycling process in the related art, even possibly because of the problem of damage LED or glass of dismounting work and so on difficult to detach from glass.