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Boat for vapor deposition and film formation method using the boat for vapor deposition

A boat and evaporation technology, which is applied in the field of evaporation boats, can solve the problems of shrinking material evaporation area, lowering the temperature of the heating surface, and the influence of uniform film formation, so as to avoid the sharp drop in temperature and eliminate the effect of droplets

Inactive Publication Date: 2015-11-25
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the material wire 6 sent out from the material wire guide 5 is melted in the air, and the droplets generated by the molten material wire 6 being dropped on the vapor deposition boat 1a affect uniform film formation.
[0016] However, in the structure of Patent Document 2, although the formation of droplets can be prevented, since the heating surface 12 is formed in the central area of ​​the pool 2, the material evaporation area is divided into two by the heating surface 12, and thus uneven film formation may occur.
In addition, there are also new technical problems such as temperature reduction around the heating surface 12 and reduction of material evaporation area.

Method used

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  • Boat for vapor deposition and film formation method using the boat for vapor deposition
  • Boat for vapor deposition and film formation method using the boat for vapor deposition
  • Boat for vapor deposition and film formation method using the boat for vapor deposition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0064] figure 1 and figure 2 (a), figure 2 (b) shows the boat for vapor deposition of Example 1 of the present invention.

[0065] The vapor deposition boat 1d has a pool 2 for storing molten thin film material formed on the upper surface U extending in the longitudinal direction connecting the one end 3a and the other end 3b of the boat main body M mainly made of graphite. like figure 2 As shown in (b), a protrusion 13a having a cross-sectional area larger than that of the other end 3b is integrally formed near the one end 3a on the back surface of the tank 2 . like figure 2 As shown in (b), a flat portion 14 having a cross-sectional area smaller than that of the protruding portion 13a is formed near the other end 3b on the back surface of the tank 2 . like figure 2 As shown in (b), an inclined portion 15a is formed between the raised portion 13a and the flat portion 14 on the rear surface of the pool 2, and the cross-sectional area of ​​the inclined portion 15a g...

Embodiment approach 2

[0080] Figure 5 and Figure 6 (a), Figure 6 (b), Figure 6 (c) shows the boat for vapor deposition of Example 2 of the present invention.

[0081] In the first embodiment, the protruding portion 13a is formed protrudingly on the back surface of the pool 2, but in the present embodiment 2, the protruding portions 13aa, 13ab are formed protrudingly on the side of the pool 2, which is different from the first embodiment.

[0082] Evaporation boat 1f is made up of pond 2, protruding part 13aa, 13ab, slope part 15aa, 15ab and flat part 14, wherein, above-mentioned protruding part 13aa, 13ab is arranged on the both sides of vapor deposition boat 1f, and above-mentioned slope part 15aa, 15ab are provided adjacent to protrusion parts 13aa, 13ab, and the said flat part 14 is provided adjacent to inclined part 15aa, 15ab.

[0083] In order to maintain the evaporation area, it is desirable that the ratio of the cross-sectional area of ​​the protrusions 13aa, 13ab to the minimum cro...

Embodiment approach 3

[0086] Figure 7 and Figure 8 (a), Figure 8 (b) shows the boat for vapor deposition of Example 3 of the present invention.

[0087] exist figure 1 and figure 2 (a), figure 2 In Example 1 shown in (b), the material supply portion 9a is formed only on the above-mentioned one end 3a side of the pool 2, but in the vapor deposition boat 1g of the present Example 3, the above-mentioned other side of the pool 2 is also formed. A material supply part 9b is formed on the one end 3b side.

[0088] That is to say, a material supply part 9b as a second material supply part connected to the material evaporation part 10 near the other end 3b is provided in the pool 2 to sandwich the material evaporation part 10, and on the back side of the pool 2 near the other end In the vicinity of 3b, a protrusion 13b as a second protrusion having a cross-sectional area larger than that of the flat portion 14 is integrally formed, and a temperature distribution is formed in the pool 2 along th...

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Abstract

Provided are an evaporation boat and a mould forming method using the same. The evaporation boat can eliminate sprays generated by fusion of material wire rods in air and a material evaporation area can not shrink. The temperature of a material supplying part (9a) on one end (3a) of a pool (2) is lower than a temperature of a material evaporation part (10) connected with on side of the other end (3b) of the material supplying part (9a). A back of the material evaporation part (10) of the pool (2) is provided with a flat part (14) and an inclined part (15a) for connecting the flat part (14) with the material supplying part (9a) which have a same sectional area; the inclined part (15a) forms a sectional area which becomes larger from the end (3a) to the other end (3b) so as to form temperature distribution.

Description

technical field [0001] The present invention relates to a boat for vapor deposition which heats and vaporizes a thin film material. Background technique [0002] As a typical method of forming a thin film on a substrate, there is a vacuum evaporation method. [0003] In the above-mentioned method, a thin film is formed on the substrate provided in the upper part of the cover chamber by keeping the cover chamber in a vacuum state and evaporating the film-forming material inside at a high temperature. The film-formed substrate exhibits the properties of the film, and can be used in various high-performance devices including semiconductors. [0004] As a heating device (evaporation source) of a vacuum evaporation apparatus, a device for heating by a resistance heating method, an electric shock method, or a high-frequency induction heating method is used, but the simple resistance heating method is widely used. [0005] In addition, the evaporation source for resistance heatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24
Inventor 竹泽昌宏山本昌裕上口洋辉大岛章义
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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