epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems of LED products such as illumination reduction and durability problems, and achieve the effect of excellent corrosion gas resistance

Inactive Publication Date: 2015-10-07
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In addition, in recent years, LED products have become brighter for lighting or TV backlights, and when LED lighting has become accompanied by a large amount of heat generation, even resin compositions using this alicyclic epoxy resin have been pointed out. There is a problem that coloration is caused on the LED chip, and the illuminance of the final LED product decreases, and there is also a problem in terms of durability (Patent Document 3)

Method used

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Examples

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Embodiment

[0180]Hereinafter, the present invention will be more specifically described through synthesis examples and examples, and the present invention is not limited to these synthesis examples and examples. In this specification, unless otherwise specified, "parts", "%", ratios and the like are all based on weight. In addition, each physical property value in an Example was measured by the following method.

[0181] (1) Molecular weight: The polystyrene-equivalent weight average molecular weight measured under the following conditions was calculated by the GPC method.

[0182] Various conditions of GPC

[0183] Manufacturer: Shimadzu Corporation

[0184] Column: guard column SHODEX GPC LF-G LF-804 (3 pieces)

[0185] Flow rate: 1.0ml / min

[0186] Column temperature: 40°C

[0187] Solvent used: THF (tetrahydrofuran)

[0188] Detector: RI (Differential Refractive Detector)

[0189] (2) Epoxy equivalent: measured by the method described in JIS K-7236.

[0190] (3) Viscosity: Me...

Synthetic example 1

[0192] As the production process (i), 106 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 234 parts of silanol-terminated methylphenyl silicone oil with a weight average molecular weight of 1700 (measured by GPC) (850 silanol equivalents, calculated as 1 / 2 of the weight-average molecular weight measured by GPC) and 18 parts of 0.5% potassium hydroxide (KOH) methanol solution were put into the reaction vessel, and the bath temperature was set to 75° C. to heat up. After heating up, the reaction was carried out under reflux for 8 hours.

[0193] As manufacturing process (ii), after adding 305 parts of methanol, 86.4 parts of 50% distilled water methanol solutions were added dropwise over 60 minutes, and it was made to react at 75 degreeC under reflux for 8 hours. After completion of the reaction, neutralize with a 5% aqueous solution of sodium dihydrogen phosphate, and then recover methanol by distillation at 80°C. 380 parts of methyl isobutyl ketone (MIBK) were added, a...

Synthetic example 2

[0195] In a flask equipped with a stirrer, a reflux condenser, and a stirring device, 20 parts of tricyclodecane dimethanol and 100 parts of methylhexahydrophthalic anhydride (manufactured by Shinnihon Chemical Co., Ltd.) were added while purging nitrogen gas. , リカカジッッド MH, hereinafter referred to as acid anhydride (C-1)), reacted at 40°C for 3 hours, then heated and stirred at 70°C for 1 hour, thus (using GPC to confirm the disappearance of tricyclodecane dimethanol (1 area% or less )) 120 parts of curing agent composition (H-1) containing polycarboxylic acid (B-1) and acid anhydride (C-1) were obtained. The obtained product was a colorless liquid resin, and its purity was measured by GPC. The polycarboxylic acid (B-1; following formula (7)) contained 55 area % and methylhexahydrophthalic anhydride contained 45 area %. In addition, the functional group equivalent was 201 g / eq.

[0196]

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Abstract

Disclosed is an epoxy resin composition containing a siloxane structure, which has excellent corrosive gas resistance. Specifically disclosed is an epoxy resin composition comprising an organopolysiloxane (A) and a polycarboxylic acid (B), wherein the organopolysiloxane (A) is an epoxy resin having at least a glycidyl group and / or an epoxycyclohexyl group in the molecule and the polycarboxylic acid (B) is a polycarboxylic acid having at least two carboxyl groups and also having an aliphatic hydrocarbon group as the main skeleton.

Description

technical field [0001] The present invention relates to an epoxy resin composition and a cured product thereof suitable for electrical and electronic material applications, particularly optical semiconductor applications. Background technique [0002] Conventionally, an epoxy resin composition has been used in consideration of the balance between performance and economy as a sealing material for optical semiconductor elements such as LED products. In particular, glycidyl ether type epoxy resin compositions typified by bisphenol A type epoxy resins excellent in balance of heat resistance, transparency, and mechanical properties are widely used. [0003] However, as a result of the development of short-wavelength light emitting wavelengths of LED products (mainly referring to the situation below 480nm in LED products that emit blue light), it is pointed out that due to the influence of short-wavelength light, the sealing material is colored on the LED chip, and eventually The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20C08G59/42
CPCC08G59/3281C08G59/42H01L2924/0002H01L2924/00C08G59/20C08L63/00H01L23/29
Inventor 中西政隆川田义浩宫川直房佐佐木智江青木静洼木健一铃木瑞观枪田正人小柳敬夫
Owner NIPPON KAYAKU CO LTD
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