Curable resin composition and cured products thereof

A technology for curing resins and compositions, applied in the fields of electric solid devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of decreased illumination and residual durability of LED products, and achieve excellent corrosion resistance. , The effect of preventing sag and excellent coloring resistance

Inactive Publication Date: 2015-07-08
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In addition, LED products in recent years are advancing toward higher luminance for lighting or backlights of televisions, and thus a large amount of heat is generated when LEDs are turned on. Therefore, resin compositions using this alicyclic epoxy resin are used on LED chips. Causes coloring, and eventually reduces the illuminance as an LED product, leaving problems in terms of durability

Method used

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  • Curable resin composition and cured products thereof
  • Curable resin composition and cured products thereof
  • Curable resin composition and cured products thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0174] Hereinafter, the present invention will be described more specifically through examples. In the following description, unless otherwise specified, "parts" means parts by weight. In addition, the present invention is not limited to these Examples. In addition, in an Example, epoxy equivalent was measured based on JIS K-7236, and viscosity was measured using the E-type viscometer at 25 degreeC. In addition, the analysis conditions of gas chromatography (hereinafter referred to as GC) are: HP5-MS (0.25mm I.D.×15m, film thickness 0.25μm) is used for the separation column, the initial temperature of the column oven temperature is set to 100°C, and the The temperature was raised at a rate of 15°C and held at 300°C for 25 minutes. In addition, helium was used as a carrier gas. In addition, the measurement conditions of gel permeation chromatography (hereinafter referred to as GPC) are as follows. The column uses ShodexSYSTEM-21 column (KF-803L, KF-802.5 (×2 pieces), KF-802)...

Synthetic example 1

[0176] Synthesis of Cyclohexene Diol

[0177] Synthesis example 1 (refer to patent document EP 0487035B1)

[0178] In a flask with a stirrer, a reflux condenser, and a stirring device, 112 parts of cyclohexene formaldehyde, 600 parts of ethanol, 300 parts of 35% formalin, and 284 parts of 30% by weight potassium carbonate aqueous solution were added while purging nitrogen. Parts, while stirring, the temperature was raised to reflux temperature, and the reaction was carried out in this state for 9 hours. After completion of the reaction, a Dean-Stark condenser was installed, and the bath temperature was kept at 100° C. for 4 hours to distill off ethanol. After cooling to room temperature, let stand as it is for 24 hours. Cyclohexene dimethanol deposited as white crystals was filtered out from the solution by filtration under reduced pressure and dried to obtain 103 parts of the target cyclohexanediol (the following formula (6)). Gas chromatographic purity was obtained in 98 ...

Synthetic example 2

[0181] In a flask with a stirrer, a reflux condenser, a stirring device, and a Dean-Stark tube, 150 parts of toluene, 70 parts of a compound of the formula (6), 3-cyclohexane 126 parts of olefinic acid and 2 parts of p-toluenesulfonic acid were reacted for 10 hours while heating under reflux while removing water. After completion of the reaction, wash twice with 50 parts of 10% by weight aqueous sodium bicarbonate solution, then wash twice the organic layer obtained with 50 parts of water, then concentrate the organic solvent with a rotary evaporator, thus obtaining the alkene compound of the present invention ( D-1, following formula (7)) 173 parts. The obtained olefin compound was in a liquid state, and its purity as measured by gas chromatography was 92 area%, and as a result of analysis by gel permeation chromatography, it was confirmed that the purity was >98 area%.

[0182]

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PUM

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Abstract

Provided is a curable resin composition which, after being heat-cured, does not suffer from depression and which exhibits excellent corrosive gas resistance and excellent optical characteristics such as discoloration resistance. Also provided are cured products of the curable resin composition. The curable resin composition is characterized by comprising an epoxy resin obtained by oxidizing an olefin compound represented by general formula (1), and either a curing agent which is reactive with the epoxy resin and / or a cure accelerator. In general formula (1), multiple R1s and R2 are each independently a hydrogen atom or C1-6 alkyl.

Description

technical field [0001] The present invention relates to a curable resin composition and a cured product suitable for electrical and electronic material applications, particularly optical semiconductor applications. Background technique [0002] The method of curing epoxy resin with acid anhydride has been used in various insulating materials and injection molding materials in the past. Especially in fields requiring optical properties, such as LED products, cured epoxy resins are used in large quantities. [0003] As epoxy resins conventionally used as sealing materials for optical semiconductor elements such as LED products, glycidyl ethers represented by bisphenol A epoxy resins with excellent balance of heat resistance, transparency, and mechanical properties have been widely used. type epoxy resin composition. [0004] However, as a result of promoting the shortening of the emission wavelength of LED products (mainly blue emission below 480nm), the sealing material is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/32C08G59/42H01L21/52H01L23/29H01L23/31
CPCH01L2924/0002C08G59/42C08L63/00H01L23/293H01L2924/00C08G59/32H01L23/29
Inventor 中西政隆佐佐木智江宫川直房洼木健一川田义浩青木静铃木瑞观枪田正人小柳敬夫
Owner NIPPON KAYAKU CO LTD
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