Curable resin composition and cured product thereof

A technology for curing resins and compositions, which can be used in electric solid state devices, semiconductor/solid state device parts, electrical components, etc., can solve problems such as resin deterioration, and achieve the effect of excellent light resistance and coloring.

Inactive Publication Date: 2016-03-16
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, adding a light stabilizer improves light resistance, but causes resin deterioration due to heat released from the LED chip, etc.

Method used

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  • Curable resin composition and cured product thereof
  • Curable resin composition and cured product thereof
  • Curable resin composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0221] As the first-stage reaction, 114 parts of β-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 234 parts of silanol-terminated methylphenyl silicone oil ( Silanol equivalent 850, calculated as 1 / 2 of the weight-average molecular weight measured by GPC) and 18 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.09 parts in terms of KOH) were put into the reaction vessel, and the bath The temperature was set to 75°C for heating. After heating up, the reaction was carried out under reflux for 8 hours.

[0222] As the second-stage reaction, 305 parts of methanol was added, and then 86.4 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and the reaction was carried out at 75° C. under reflux for 8 hours. After the reaction, neutralize with 5% sodium dihydrogen phosphate aqueous solution, and then carry out distillation and recovery of methanol at 80°C. Add 380 parts of methyl isobutyl ketone (MIBK), and repeat the water wash three times....

Synthetic example 2

[0224] As the first-stage reaction, 257 parts of β-(3,4-epoxycyclohexyl) ethyl trimethoxysilane, 505 parts of silanol-terminated methyl phenyl silicone oil ( Silanol equivalent of 850, calculated as 1 / 2 of the weight average molecular weight measured by GPC) and 40 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.2 parts in terms of KOH) were put into the reaction vessel, and the bath The temperature was set to 75°C for heating. After heating up, the reaction was carried out under reflux for 8 hours.

[0225] As the second-stage reaction, 510 parts of methanol was added, and then 130 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and the reaction was carried out at 75° C. under reflux for 8 hours. After the reaction, neutralize with 5% sodium dihydrogen phosphate aqueous solution, and then carry out distillation and recovery of methanol at 80°C. Add 704 parts of methyl isobutyl ketone (MIBK), and repeat the water wash three tim...

Synthetic example 3

[0227]In a flask equipped with a stirrer, a reflux condenser, and a stirring device, 20 parts of tricyclodecane dimethanol, 100 parts of methylhexahydrophthalic anhydride (manufactured by Shinnihon Chemical Co., Ltd. , リカシツド MH, hereinafter referred to as acid anhydride H-1), reacted at 40°C for 3 hours, and then heated and stirred at 70°C for 1 hour, thus (confirming the disappearance of tricyclodecane dimethanol (less than 1 area %) by GPC) to obtain 120 parts of curing agent composition (T-1) containing polycarboxylic acid (B-1) and acid anhydride (H-1).The gain is a colorless liquid resin, and the purity is measured by GPC, polycarboxylic acid (B-1; The following formula (9)) is 55 area %, and methyl hexahydrophthalic anhydride is 45 area %. In addition, the functional group equivalent is 201 g / eq.

[0228]

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Abstract

The aim of the present invention is to provide a novel curable resin composition which provides a cured product having superior light-fast colouring properties, heat-resistant colouring properties, and corrosive-gas resistant properties. The curable resin composition of the present invention contains an organopolysiloxane (A), a polyvalent carboxylic acid (B), an organic metal salt and / or an organic metal complex (C), and a light stabiliser (D). The organopolysiloxane (A), the polyvalent carboxylic acid (B), and the light stabiliser (D) meet the following conditions. Organopolysiloxane (A): An organopolysiloxane having at least a glycidil group and / or an epoxycyclohexyl group in the molecules thereof. Polyvalent carboxylic acid (B): A polyvalent carboxylic acid having at least two carboxyl groups, and an aliphatic hydrocarbon group as the main skeleton. Light stabiliser (D): A compound represented by structural formula (1).

Description

technical field [0001] The present invention relates to a curable resin composition and a cured product suitable for electrical and electronic material applications, particularly optical semiconductor applications. Background technique [0002] Conventionally, an epoxy resin composition has been used from the viewpoint of the balance of performance and economical efficiency as a sealing material of optical semiconductor elements, such as LED products. In particular, glycidyl ether-type epoxy resin compositions represented by bisphenol A-type epoxy resins excellent in balance of heat resistance, transparency, and mechanical properties are widely used. [0003] However, the result of shortening the emission wavelength of LED products (mainly below 480nm in blue light-emitting LED products) is pointed out that due to the influence of short-wavelength light, the sealing material is colored on the LED chip, and finally becomes an LED chip. The product has the problem of a decrea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20C08K5/3435C08L63/00H01L23/29H01L23/31H01L33/56
CPCH01L23/293C08G59/3263C08G77/14C08K5/0091C08K5/092C08K5/098C08K5/3435C08L63/00C09J183/06H01L33/56H01L2924/0002
Inventor 青木静川田义浩佐佐木智江
Owner NIPPON KAYAKU CO LTD
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