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Curable resin composition and cured product thereof

A curable resin and composition technology, applied in the direction of electric solid-state devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of LED products such as reduced illumination and durability problems, and achieve excellent optical properties.

Inactive Publication Date: 2015-06-24
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In addition, in recent years, LED products have been further promoted for lighting and TV backlights, etc., and LEDs generate a lot of heat when they are turned on. Therefore, even resin compositions using this alicyclic epoxy resin will suffer Coloration occurs on the LED chip, which eventually lowers the illuminance as an LED product, and also has problems in durability (Patent Document 3)

Method used

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  • Curable resin composition and cured product thereof
  • Curable resin composition and cured product thereof
  • Curable resin composition and cured product thereof

Examples

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Embodiment

[0218] Hereinafter, the present invention will be described in more detail through synthesis examples and examples. In addition, this invention is not limited to these synthesis examples and Examples. In addition, in the following synthesis examples and Examples, "part" means "weight part", and "%" means "weight%". In addition, each physical property value in an Example was measured by the following method.

[0219] (1) Molecular weight: The molecular weight measured by the gel permeation chromatography (GPC) method under the following conditions was converted into polystyrene, and the weight average molecular weight was calculated.

[0220] Various conditions of GPC

[0221] Manufacturer: Shimadzu Corporation

[0222] Chromatographic column: guard column SHODEX GPC, LF-G, LF-804 (3 pieces)

[0223] Flow rate: 1.0ml / min

[0224] Column temperature: 40°C

[0225] Solvent used: THF (tetrahydrofuran)

[0226] Detector: RI (Differential Refractive Detector)

[0227] (2) Ep...

Synthetic example 1

[0230] As the manufacturing process (i), 106 parts of β-(3,4 epoxycyclohexyl) ethyl trimethoxysilane, 234 parts of silanol-terminated methyl phenyl silicone oil ( Silanol equivalent 850, calculated by half of the weight-average molecular weight measured by GPC), 18 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.09 parts in terms of KOH parts) are packed into the reaction vessel, and the bath The temperature was set at 75°C and ramped up. After raising the temperature, it was allowed to react under reflux for 8 hours.

[0231] As the production process (ii), after adding 305 parts of methanol, 86.4 parts of 50% distilled water-methanol solution was added dropwise over 60 minutes, and it was made to react at 75 degreeC under reflux for 8 hours. After the reaction, neutralize with 5% sodium dihydrogen phosphate aqueous solution, and then carry out distillation recovery of methanol at 80°C. Add 380 parts of methyl isobutyl ketone (MIBK), and repeat washing with wat...

Synthetic example 2

[0233] 20 parts of tricyclodecane dimethanol and 100 parts of methylhexahydrophthalic anhydride (manufactured by Shinnihon Rika Co., Ltd., リカシツド MH , hereinafter referred to as acid anhydride (H-1)), reacted at 40°C for 3 hours, then heated and stirred at 70°C for 1 hour (confirmed the disappearance of tricyclodecane dimethanol (less than 1 area %) by GPC), obtained by This gave 120 parts of curing agent composition (T-1) containing polyhydric carboxylic acid (B-1) and acid anhydride (H-1). The obtained curing agent composition (T-1) is a colorless liquid resin, and the purity measured by GPC is that polycarboxylic acid (B-1; following formula (7)) is 55 area %, acid anhydride (H- 1) is 45 area%. In addition, the functional group equivalent was 201 g / eq. In addition, the viscosity at 25° C. was 18900 mPa·s (E-type viscometer).

[0234]

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Abstract

Provided is a curable resin composition that produces a cured product having excellent resistance to corrosion with respect to gases and the like in the environment, and excellent optical properties in terms of thermal discoloration resistance and light extracting efficiency. The essential ingredients of the curable resin composition are an organopolysiloxane (A) and a zinc salt and / or zinc complex (C). The organopolysiloxane (A) satisfies the following conditions. The organopolysiloxane (A) is an epoxy resin having at least glycidyl groups and / or epoxycyclohexyl groups in the molecules thereof.

Description

technical field [0001] The present invention relates to a curable resin composition suitable for use in electric and electronic materials, particularly a use in optical semiconductors, and a cured product thereof. Background technique [0002] As sealing materials for optical semiconductor elements such as LED products, epoxy resin compositions have been used from the standpoint of a balance between performance and economical efficiency. In particular, glycidyl ether-type epoxy resin compositions typified by bisphenol A-type epoxy resins, which are excellent in balance among heat resistance, transparency, and mechanical properties, are widely used. [0003] However, as the emission wavelength of LED products becomes shorter (mainly 480nm for blue light-emitting LED products), it is pointed out that under the influence of short-wavelength light, the above-mentioned sealing material is colored on the LED chip, Finally, the illuminance of LED products is reduced. [0004] The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/30C08G59/42C08G77/38C08K5/3435C08L63/00H01L23/29H01L23/31
CPCC08G59/685C08G77/14C08K5/0091C08L63/00C08L83/06H01L23/293H01L23/295H01L33/56H01L2924/0002H01L2924/00C08G59/30C08G77/38C08K5/3435C08L83/04
Inventor 中西政隆川田义浩佐佐木智江青木静宫川直房漥木健一铃木瑞观枪田正人小柳敬夫
Owner NIPPON KAYAKU CO LTD
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