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Execution apparatus and manipulator

A technology of an execution device and an arm, which is applied in the field of microelectronics, can solve problems such as failure of chip suction, and achieve the effect of avoiding failure of chip suction

Active Publication Date: 2014-12-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an execution device and a manipulator, which are used to solve the problem that the execution device fails to pick up wafers

Method used

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  • Execution apparatus and manipulator
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  • Execution apparatus and manipulator

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Embodiment Construction

[0036] In order to enable those skilled in the art to better understand the technical solution of the present invention, the execution device and the manipulator provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Embodiment 1 of the present invention provides an implementing device, the implementing device includes a first sealing member for linearly contacting the sucked wafer, and the sucked wafer is sucked during the process of the sucked wafer being sucked by the executing device on the first closure part.

[0038] The execution device provided in this embodiment includes a first sealing member for linearly contacting the sucked wafer, and the sucked wafer is adsorbed on the first sealing member during the process of the suction wafer being sucked by the execution device . In the present invention, the actuator linearly contacts the adsorbed wafer through the first sealing part, and the adsorbed wafer ...

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Abstract

The invention provides an execution apparatus and a manipulator. The execution apparatus comprises a first sealing part which is used to linearly contact an adsorbed wafer. During a process that the execution apparatus adsorbs the adsorbed wafer, the adsorbed wafer adsorbs the first sealing part. In the technical scheme provided in the invention, the execution apparatus linearly contact the adsorbed wafer through the first sealing part and the adsorbed wafer does not need to carry out direct surface contact with the first part so that a problem that a preset degree of vacuum is not reached because of a gap generated by the surface contact between the adsorbed wafer and the execution apparatus is avoided and the execution apparatus can successfully absorb the wafer.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to an execution device and a manipulator. Background technique [0002] With the significant improvement in the process efficiency of manufacturing crystalline silicon solar cells, the solar cell production line has higher and higher requirements for the automatic transfer efficiency of wafers, which requires all aspects of wafer transfer to work at high speed and reliably. In the process of wafer transfer, the operation of taking out the wafer from the magazine is the first step in the wafer transfer process, and the speed and reliability of this step are directly related to the transfer efficiency of the wafer. figure 1 It is a structural schematic diagram of a material box, such as figure 1 As shown, the magazine includes a plurality of oppositely disposed wafer slots 11, and every two oppositely disposed wafer slots 11 can be used to place a wafer. Removing the wafer ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L31/18
CPCY02P70/50
Inventor 张金斌
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD