Temperature regulating device

A technology of a temperature adjustment device and an air supply device, which is applied in the direction of seat heating/ventilation devices, etc., can solve the problems of poor achievability, unsightly appearance, and large volume.

Inactive Publication Date: 2013-01-02
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, a built-in seat temperature control device adopts two axial flow fans stacked up and down, and a thermoelectric device is placed in the middle for temperature control. Its thickness is too thick and it is difficult to put it inside the seat; The temperature device uses a water tank inside the seat to cool the seat by pouring cold water. This kind of device needs to be filled with water frequently, and the feasibility is poor.
[0004] The external seat temperature adjustment device needs to be installed outside the seat, which is not beautiful enough, and because of its large size, it not only takes up space in the car, but also poses a certain safety hazard
Some external seat temperature adjustment devices use the car's own air conditioner and water heating to input the temperature adjustment form inside the seat through pipes. This form undoubtedly brings a greater burden to the car air conditioner, and the gas flows into the seat and is input to the seat. The surface requires greater pressure, which virtually increases the energy consumption of the car, and the damage rate of the car air conditioner is also greatly increased

Method used

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Embodiment approach 2

[0034] The temperature regulation principle of the temperature regulation device 200 in Embodiment 2 is the same as that of the temperature regulation device 100 . The difference between the temperature regulation device 200 and the temperature regulation device 100 is: 1) The tops of the air supply part 211 and the temperature regulation part 212 are flush, so that the upper wall of the housing 210 is a flat structure. The shape of the cavity of the casing 110 is different, and the components in the casing 210 are also arranged axially, so it is beneficial to reduce the height; 2) Adapt to the shape of the cavity of the casing 210, the air supply device 250 adopts a centrifugal fan instead of an axial flow Fan; 3) Compared with the temperature adjustment device 100, an air guide vane 260 is added, and the air guide vane 260 is arranged between the air supply device 250 and the temperature adjustment assembly 220, so that the air flow reaching the temperature adjustment assembl...

Embodiment approach 3

[0038] The temperature regulation device 300 of Embodiment 3 is the same as the temperature regulation method of the temperature regulation device 200 of Embodiment 2. It also uses a centrifugal fan, and the shell structure of the two is also very similar. The only difference is that: the air supply part 311 is relatively The temperature regulating part 312 is arranged obliquely, and the two are connected at a certain angle. In this way, when the air blower 350 (centrifugal fan) is installed in the air blower 311, compared with the air blower 250 in Embodiment 2, the velocity and flow direction distribution of the airflow delivered by the air blower 350 is changed, thus Meet different usage requirements. It should be pointed out that the change of the velocity and distribution of the airflow can also be realized by adjusting the angle of the blades of the centrifugal fan.

[0039] The temperature regulating device of the above-mentioned embodiment utilizes the semiconductor r...

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PUM

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Abstract

The invention relates to a temperature regulating device which comprises a casing, a temperature regulating assembly and an air supplying device, wherein the temperature regulating assembly and the air supplying device are installed in the casing. The temperature regulating assembly comprises a semiconductor refrigeration / heating sheet, a first radiating fin and a second radiating fin, a first air channel and a second air channel are isolated and formed on two sides of the semiconductor refrigeration / heating sheet, the semiconductor refrigeration / heating sheet is provided with a refrigeration surface and a heating surface, the first radiating fin and the second radiating fin are respectively installed on the working surfaces, the first radiating fin is located in the first air channel, and the second radiating fin is located in the second air channel. After being conveyed to the temperature regulating assembly by the air supplying device, air flow is shunted and heated or refrigerated in the first air channel and the second air channel and then is discharged out of the casing. The temperature regulating device utilizes the semiconductor refrigeration / heating sheet to regulate temperature of a seat, no vehicle-mounted air conditioning needs to be led in, and load of the vehicle-mounted air conditioning and automobile energy consumption cannot be increased.

Description

technical field [0001] The invention relates to the field of temperature regulation, in particular to a temperature regulation device for car seats or mattresses. Background technique [0002] Current seats and mattresses, especially car seats, have the problem of poor air permeability, and the moisture on the seats cannot be dissipated in time. In summer, under the direct sunlight, the temperature inside the car is too high, and it takes a certain amount of time to adjust the air conditioner, which makes the occupants feel uncomfortable for a long time. Current thermostats are mainly divided into two types: built-in seat thermostats and external seat thermostats. The built-in seat temperature adjustment device refers to the temperature adjustment device installed inside the seat, and at the same time completes the whole process of adjusting the temperature of the gas and sending the gas into the seat inside the seat. The external seat temperature control device refers to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60N2/56
Inventor 何凯李赳华李莉莉杜如虚
Owner SHENZHEN INST OF ADVANCED TECH
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