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Manufacturing method of circuit board for solving via hole problem

A technology of via holes and plug holes, which is applied in the direction of electrical connection formation of printing components, etc., can solve the problems of no abrasive belt grinder, copper damage, and difficulty in removing ink.

Inactive Publication Date: 2013-01-02
凯迪思科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It is difficult to remove the ink overflowing the hole after plugging the hole. Generally, the abrasive belt grinder is used for processing, but the general circuit board manufacturer does not have the abrasive belt grinder, and the abrasive belt grinder also has a great impact on the copper on the surface. damage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] To illustrate the implementation process of the present invention in detail, an example is described as follows:

[0027] A. Drilling, copper sinking, electroplating.

[0028] The aperture of the via hole is 0.3mm, normal copper sinking, full-board electroplating, and the electroplating copper thickness in the hole is 25um.

[0029] B. Fill the via hole with ink.

[0030] The drill hole of the aluminum sheet that needs to be plugged through the hole is 0.45mm. The hole is plugged with solder mask ink, and the solder mask ink does not add diluent. The aluminum sheet is manually printed three times to ensure that the bottom of the through hole is oily.

[0031] C. Pre-cured ink.

[0032] The pre-curing temperature is 70 degrees Celsius and the time is 30 minutes.

[0033] D. Remove the ink outside the via hole.

[0034] Use 600# non-woven cloth brushing machine, brushing speed 1.8m / min, wear scar width 10mm, brushing twice, if there is ink on the edge of the hole, you can m...

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PUM

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Abstract

The invention relates to a manufacturing method of a circuit board for solving a via hole problem, which is used for solving the problems that via holes are offset holes and are blocked, printing ink in a plug hole is difficult to remove, and the like. The method comprises the following steps of: plugging a hole after panel plating is adopted, protecting copper inside the hole by using the printing ink inside the hole, and then removing the printing ink outside an overflow hole after procuring. The problems of via hole blockage caused by the offset holes, too small annular ring and line deviation can be prevented, and the difficult problem that the printing ink is difficult to remove to damage lines is solved without additionally increasing the cost of the plug hole.

Description

Technical field [0001] The invention relates to a method for manufacturing a printed circuit board, which is a method for manufacturing a circuit board that solves the problems of partial via holes, blocked via holes, and difficult removal of plug hole ink. Background technique [0002] Vias are metallized holes that play a conductive role in the circuit board. Vias and annular rings occupy more space on the circuit board. As the circuit board develops towards light, thin, short and small, vias and annular rings Also getting smaller. [0003] In the production process of the circuit board, the deviation of drilling, film deformation and positioning deviation will cause the deviation of the hole relative to the hole ring. Generally, the hole and the film offset are within 3 mils, and the hole ring needs more than 6 mils. Make sure that the hole does not break out of the ring. If the hole is drilled out of the ring, the copper of the hole will be corroded and the via will be blocke...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 黄明安
Owner 凯迪思科技股份有限公司
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