Method for manufacturing MWT (Metal Wrap Through) battery by adopting screen overprinting technology
A stencil and battery technology, applied in the field of solar cells, can solve the problems of increased unit consumption of conductive paste, expensive conductive paste and high cost
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Embodiment 1
[0013] The specific steps of using the method of the present invention to produce a battery are: 1. First, the silicon wafer is processed by the following steps: laser through-hole, silicon wafer surface layer removal, texturing, phosphorus diffusion, etching edge removal, back junction removal, deposition reduction 2. Next, on the backlight side of the silicon wafer, a small opening screen is used, and the dot-shaped electrode pattern is used. The diameter of the electrode is 1 mm. Print once at the through hole; 3. The conductive paste forms a dot-shaped electrode on the surface of the silicon wafer, and at the same time realizes the slurry filling; 4. The silicon wafer directly enters the next printing without drying, using a large opening screen, 3 mm diameter point electrode mesh plate, and similar operations are performed again to form through-hole electrodes; 5. Next, the back electrode, the back electric field, the front grid line are printed, and finally sintered and m...
Embodiment 2
[0015] The specific steps of using the method of the present invention to produce a battery are: 1. First, the following steps are used for the silicon wafer: laser through hole, silicon wafer surface layer removal, texturing, phosphorus diffusion, etching edge removal, back junction removal, deposition of anti-reflection film 2. Next, on the backlight surface of the silicon wafer, a small opening screen is used, and the electrode pattern is dotted. The diameter of the electrode is 1 mm. According to the needs of the MWT battery, it is arranged into 4×4, and the position of the screen is adjusted. The hole is printed once; 3. The conductive paste forms a dot-shaped electrode on the surface of the silicon wafer, and at the same time fills the hole with the paste; 4. The silicon wafer directly enters the next printing without drying, using a large opening screen, size 3 8 mm strip electrode mesh plate, and similar operations are performed again to form through-hole electrodes; 5....
Embodiment 3
[0017] The specific steps of using the method of the present invention to produce a battery are: 1. First, the following steps are used for the silicon wafer: laser through hole, silicon wafer surface layer removal, texturing, phosphorus diffusion, etching edge removal, back junction removal, deposition of anti-reflection film 2. Next, on the backlight surface of the silicon wafer, a large opening screen is used, and the electrode pattern is dotted. The diameter of the electrode is 3 mm. According to the needs of the MWT battery, it is arranged in 5 × 5, and the position of the screen is adjusted. The hole is printed once; 3. The conductive paste forms a dot-shaped electrode on the surface of the silicon wafer, and at the same time fills the hole with the paste; Millimeter dot electrode mesh plate, and similar operations are performed again to form through-hole electrodes; 5. Next, the back electrode, the back electric field, the front grid line are printed, and finally sintere...
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