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Multi-stage stamping die structure

A stamping die and punch technology, which is applied in the field of multi-stage stamping die structure, can solve the problems of waste of machine equipment, time transfer of semi-finished products, and occupation of funds

Inactive Publication Date: 2015-04-01
江门市长辉五金电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In production, many stamping parts need to be divided into multiple stamping steps to complete, and each stamping step requires a special equipment or station, which requires the cooperation of multiple molds or multiple punches, which requires precise positioning Technology will also generate a lot of time for transferring semi-finished products, resulting in waste of time, waste of machine equipment and occupation of a lot of money

Method used

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  • Multi-stage stamping die structure
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  • Multi-stage stamping die structure

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Experimental program
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Embodiment Construction

[0022] Below with reference to accompanying drawing and in conjunction with embodiment, describe the present invention in detail:

[0023] refer to Figure 1 to Figure 3 As shown, a multi-stage stamping die structure includes an upper mold bottom plate 1 and a lower mold bottom plate 2, the upper mold bottom plate 1 is fixedly connected with the multi-stage punch 3, and the lower mold bottom plate 2 is connected to the The lower mold fixed plate 5 is connected, and two lower mold supporting plates 6 are arranged between the lower mold bottom plate 2 and the lower mold fixed plate 5, and the inner movable punching sleeve 7, the middle mold fixed plate 5 are arranged in sequence in sequence. A movable punching sleeve 8 and an outer movable punching sleeve 9, a punching sleeve drive shaft 10 is arranged in the middle of the inner movable punching sleeve 7, a slide block 15 is arranged between the two lower die supporting plates 6, and the The slide block 15 is also fitted and co...

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PUM

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Abstract

The invention discloses a multi-stage stamping die structure. The multi-stage stamping die structure is characterized by consisting of an upper die bottom plate and a lower die bottom plate, wherein the upper die bottom plate is fixedly connected with a multi-stage punch; the lower die bottom plate is connected with a lower die fixing plate through a connecting bolt; two lower die supporting plates are arranged between the lower die bottom plate and the lower die fixing plate; an inner movable stamping sleeve, a middle movable stamping sleeve and an outer movable stamping sleeve are arranged in the lower die fixing plate in sequence; and a stamping sleeve driving shaft is arranged in the middle of the inner movable stamping sleeve. The multi-stage stamping die structure is convenient to use and can finish multiple stamping steps by using one punch and one stamping operation to perform processing and manufacturing, so that time, machine equipment and financial resources are saved.

Description

technical field [0001] The invention relates to the field of molds, in particular to a multi-stage stamping mold structure. Background technique [0002] In production, many stamping parts need to be divided into multiple stamping steps to complete, and each stamping step requires a special equipment or station, which requires the cooperation of multiple molds or multiple punches, which requires precise positioning Technology will also generate a lot of time for transferring semi-finished products, resulting in waste of time, waste of machine equipment and occupation of a lot of money. Contents of the invention [0003] The purpose of the present invention is to overcome the above problems existing in the prior art, and provide a multi-stage stamping die structure. The present invention is easy to use, and can be processed and manufactured by completing multiple stamping steps with one punch, saving time and machine equipment. and financial resources. [0004] In order t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D37/10
Inventor 征茂德陈巧云
Owner 江门市长辉五金电器有限公司