Die Bonding Device
A chip bonding and feeding technology, applied in the field of bonding die devices
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Embodiment 1
[0021] Embodiment 1: A chip bonding device
[0022] see Figure 1 and Figure II As shown, the chip bonding device has a supply module 10, at least one turning module 11, a rotating module 12, at least two pick-and-place modules 13, a gluing module 14, a feeding module 15, at least one first visual positioning The module 16 and a second visual positioning module 17 .
[0023] Such as Figure 1 and Figure II As shown, a supply module 10 is provided with a plurality of dies 18 .
[0024] The overturning module 11 is disposed above the supply module 10 , and the overturning module 11 has functions of suction and rotation.
[0025] The feeding module 15 is disposed on one side of the supply module 10 .
[0026] The rotating module 12 is arranged between the supply module 10 and the feeding module 15 .
[0027] At least two pick-and-place modules 13 are disposed on the rotating module 12 .
[0028] At least one gluing module 14 is disposed below the rotating module 12 .
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Embodiment 2
[0031] Embodiment 2: A chip bonding device
[0032] Please cooperate with reference Figure three As shown, in this embodiment, only the turnover module 11, the first visual positioning module (not shown in the figure), the rotation module 12, the pick-and-place module 13, the glue module 14 and the feeding module 15 are increased in number, and the rest of the components are all It is the same as the first embodiment, so the component symbols are used in the first embodiment, which is hereby described.
[0033] Such as Figure three As shown, two feeding modules 15 are respectively arranged on two sides of the supply module 10 .
[0034] Each first vision module 16 is disposed above the feeding module 15 .
[0035] Two turning modules 11 are disposed on the supply module 10 , and each turning module 11 corresponds to each rotating module 12 .
[0036] The two rotating modules 12 are respectively arranged between one of the feeding modules 15 and the supply module 10 .
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Embodiment 3
[0039] Embodiment 3: A chip bonding device
[0040] Please cooperate with reference Figure four and Figure five As shown, in this embodiment, only the number of pick-and-place modules 13 is increased, and the rest of the components are the same as those in Embodiment 2, so the symbol of the components follows Embodiment 1, which is hereby described.
[0041] Four pick-and-place modules 13 are arranged on each rotating module 12 , and any two adjacent pick-and-place modules 13 have a certain distance.
[0042] Please refer to Figure II As shown, the second vision positioning module 17 locates the die 18 located on the supply module 10, and after the turning module 11 receives the information from the second vision positioning module 17, the turning module 11 absorbs the selected die 18 located on the supply module 10 , and flip the sucked crystal grains, for example, the flip angle can be between 90 and 270 degrees, the pick-and-place module 13 sucks the crystal grains 18...
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