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Electronic equipment

A technology for electronic equipment and circuit boards, applied in electrical components, printed circuit components, magnetic field/electric field shielding, etc., to solve problems such as common ground of circuit boards

Active Publication Date: 2013-06-05
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention solves the problem of common grounding of multiple circuit boards in the prior art, thereby providing a common grounding electronic device

Method used

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Embodiment Construction

[0011] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0012] figure 1 It is a schematic structural diagram of an electronic device according to the first embodiment of the present invention; an electronic device is disclosed, including: a first circuit board 1, a second circuit board 2, and a third circuit board 3; the first circuit board 1 is provided with The first conductive component 11; the second circuit board 2 is provided with a second conductive component 21; the third circuit board 3 is provided with a conductive common ground through hole 31; the first conductive component 11 and the second conductive The compon...

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Abstract

Electronic equipment comprises a first circuit board, a second circuit board and a third circuit board, wherein a first conductive part is arranged on the first circuit board; a second conductive part is arranged on the second circuit board; a conductive common-ground through hole is formed on the third circuit board; and the first conductive part and the second conductive part are electronically connected with the conductive common-ground through hole. According to the electronic equipment, common-ground of the three circuit boards is achieved due to the fact that the first conductive part and the second conductive part are electronically connected with the conductive common-ground through hole.

Description

technical field [0001] The invention relates to communication equipment, in particular to a shared electronic equipment. Background technique [0002] In many electronic devices nowadays, such as mobile phones, PDAs, cordless phones and other electronic devices, in order to meet the thickness requirements of the whole machine and various complex circuit structures, a mobile phone or other electronic devices will be composed of multiple circuit boards. Multi-board design will have a great impact on the performance of electronic equipment. Both radio frequency related performance and baseband circuit performance with high-speed data transmission rate will be degraded to varying degrees due to the fact that multiple circuit boards do not share the same ground. Therefore, the design of common ground components for multi-circuit board mobile phones has become particularly important. Contents of the invention [0003] The present invention solves the problem of multiple circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K9/00
Inventor 武姝妮
Owner BYD CO LTD