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A combined radiator

A radiator and combined technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of excess cooling capacity, cost waste, cost waste, etc., and achieve the effect of saving product costs

Active Publication Date: 2015-12-23
SHENZHEN INVT ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For serialized electronic products, one chassis is usually used to be compatible with products of several power levels. Products of different power levels are equipped with heating elements of different power levels, and heating elements of different power levels have requirements for the cooling capacity of radiators. The heat generated by these heating elements is also different during the working process. In order to ensure that products of all power levels can dissipate heat effectively, the heat sink is usually designed according to the heat dissipation requirements of the product with the highest power level. In this way, when the heat sink When applied to low-power products, the radiator has the problem of excess cooling capacity, resulting in waste of cost, especially under the condition that each heating element is installed in a chassis, the greater the power difference between the heating elements, the excess cooling capacity and waste The problem of cost is more serious

Method used

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  • A combined radiator
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Examples

Experimental program
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Effect test

Embodiment 1

[0026] This embodiment proposes a combined radiator, combining figure 1 , figure 2 and image 3 As shown, it includes a base plate 1, at least two heat dissipation fins 10 are extended outwardly from the base plate 1, and a heat dissipation plate 2 is arranged between two adjacent heat dissipation fins 10, and the heat dissipation plate 2 is arranged on the base plate 1. 2 is correspondingly provided with a groove 11, and the upper end of the heat sink 2 is embedded in the groove 11. In the combined radiator, the heating element 3 is attached to the upper surface of the substrate 1, and the heat generated by the heating element 3 during operation can be dissipated through the substrate 1 and the cooling fins 10. When the radiator is applied to multiple When there are heating elements 3 of one power level, a corresponding number of heat dissipation plates 2 can be embedded in the grooves 11 on the substrate 1 according to the heat dissipation requirements of the heating elem...

Embodiment 2

[0030] The combined radiator proposed in this embodiment combines Figure 4 , Figure 5 and Figure 6 Shown, its difference with embodiment 1 is:

[0031] A plurality of fins 21 extend outward from both sides of the heat dissipation plate 2 , and the surface area of ​​the heat dissipation plate 2 is increased through the fins 21 , thereby improving its heat dissipation capability. On the substrate 1, the lower ends of two adjacent heat dissipation fins 10 are connected by a baffle 12, the heat dissipation fins 10 and the baffle 12 are integrally formed, and the heat dissipation plate 2 is located on the substrate 1, adjacent two In the space formed by the heat dissipation fins 10 and the baffle plate 12. For the heat sink with this structure, since the heat dissipation plate 2 is set independently, the number of heat dissipation plates 2 installed on the substrate 1 can be adjusted according to the heat dissipation requirements to flexibly adjust its heat dissipation perfor...

Embodiment 3

[0035] combine figure 1 , Figure 4 and Figure 7 As shown, the groove 11 is a dovetail groove, and the upper end of the heat dissipation plate 2 is formed with a dovetail tenon 22, and the dovetail tenon 22 is embedded in the dovetail groove, wherein, through the interaction between the dovetail tenon 22 and the dovetail groove Cooperating, the heat dissipation plate 2 can be multi-directionally loaded and more stably installed on the base plate 1 .

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Abstract

The invention discloses a combined-type heat radiator. The combined-type heat radiator comprises a base plate, wherein at least two heat-radiation fins extend out of the base plate, a heat-radiation plate is arranged between at least one set of the two adjacent heat-radiation fins, concave grooves corresponding to the heat-radiation plates are formed in the base plate, and one end portion of each heat-radiation plate is embedded inside each concave groove. When the heat radiator is applied to an electronic product with multiple power levels, a corresponding number of heat-radiation plates are embedded into the concave grooves in the base plate according to the heat-radiation requirements of heating elements, the heat-radiation performance of the heat radiator is adjusted, and the problem that the heat-radiation capacity is surplus when the heat radiator is applied to low-power heating elements is avoided. Meanwhile, the heat radiator does not need to be designed according to the heat-radiation requirements of the heating element with the maximum power, and therefore the cost of the product is saved.

Description

technical field [0001] The invention relates to a cooling device for electronic equipment, in particular to a combined radiator. Background technique [0002] For serialized electronic products, one chassis is usually used to be compatible with products of several power levels. Products of different power levels are equipped with heating elements of different power levels, and heating elements of different power levels have requirements for the cooling capacity of radiators. The heat generated by these heating elements is also different during the working process. In order to ensure that products of all power levels can dissipate heat effectively, the heat sink is usually designed according to the heat dissipation requirements of the product with the highest power level. In this way, when the heat sink When applied to low-power products, the radiator has the problem of excess cooling capacity, resulting in waste of cost, especially under the condition that each heating eleme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 毕金成殷江洪
Owner SHENZHEN INVT ELECTRIC