Combined-type cooling system
A heat dissipation system and combined technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of excess heat dissipation capacity, cost waste, cost waste, etc., and achieve the effect of saving product costs
Inactive Publication Date: 2016-01-27
LUOYANG DEWEI ELECTROMECHANICAL TECH CO LTD
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Problems solved by technology
[0002] For serialized electronic products, one chassis is usually used to be compatible with products of several power levels. Products of different power levels are equipped with heating elements of different power levels, and heating elements of different power levels have requirements for the heat dissipation capacity of the cooling system. The heat generated by these heating elements is also different during the working process. In order to ensure that products of all power levels can dissipate heat effectively, the heat dissipation system is usually designed according to the heat dissipation requirements of products with the highest power level. In this way, when the heat dissipation system When applied to low-power products, the heat dissipation system has the problem of excess heat dissipation capacity, resulting in waste of cost, especially under the condition that each heating element is installed in a chassis, the greater the power difference between the heating elements, the excess heat dissipation capacity and waste The problem of cost is more serious
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[0019] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of a combined heat dissipation system proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its efficacy is described in detail.
[0020] refer to figure 1 , figure 2 , as shown, is an exploded view and a side view of the combined cooling system of the present invention. Wherein, the combined heat dissipation system includes a substrate 1, at least two heat dissipation fins 10 extending outward from the above substrate 1, a heat dissipation plate 2 is arranged between two adjacent heat dissipation fins 10, and the heat dissipation plate 2 is arranged on the above substrate 1 and the heat dissipation The plate 2 is correspondingly provided with a groove 11 , and the upper end of the...
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The present invention relates to a combined-type cooling system. The system comprises a substrate, the substrate extends outwards to form at least two cooling fins, a cooling plate is disposed between at least one group of adjacent two cooling fins, the substrate is provided with grooves corresponding to the cooling plates, and upper end parts of the cooling plates are embedded into the grooves. With adoption of the combined-type cooling system, the problem, of excess cooling ability, occurred when the cooling system is applied to small-power heating elements is avoided, and design of the cooling system according to heating requirements of maximum-power heating elements is also avoided, thereby saving product costs.
Description
technical field [0001] The invention relates to a cooling system, in particular to a combined cooling system. Background technique [0002] For serialized electronic products, one chassis is usually used to be compatible with products of several power levels. Products of different power levels are equipped with heating elements of different power levels, and heating elements of different power levels have requirements for the heat dissipation capacity of the cooling system. The heat generated by these heating elements is also different during the working process. In order to ensure that products of all power levels can dissipate heat effectively, the heat dissipation system is usually designed according to the heat dissipation requirements of products with the highest power level. In this way, when the heat dissipation system When applied to low-power products, the heat dissipation system has the problem of excess heat dissipation capacity, resulting in waste of cost, especi...
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IPC IPC(8): H05K7/20
Inventor 田彩霞
Owner LUOYANG DEWEI ELECTROMECHANICAL TECH CO LTD