Server heat dissipation method and device, equipment and medium

Abstract

The invention provides a server heat dissipation method and device, equipment and a medium, and the method comprises the steps of enabling a BMC to obtain heat parameter information in real time, and the heat parameter information comprising the heat information of a power supply module, the heat information of a CPU, the heat information of a memory, and the heat information of a PCIE; obtaining a server heat dissipation type, and respectively obtaining corresponding regional regulation and control values according to the heat information of the power supply module, the CPU heat information, the memory heat information and the PCIE heat information based on the heat dissipation type; determining an adjustment value according to all the regional regulation and control values and the corresponding weight values; and sending the adjustment value to the cooling device to adjust heat dissipation of the server. A large amount of external temperature sensors are reduced, and the cost can be reduced; the heat information is used for determining the adjustment value of the cooling equipment, and the real-time performance is better than that of a temperature sensor.

Description

technical field [0001] The present application relates to the technical field of server heat dissipation, and in particular to a server heat dissipation method, device, electronic equipment, and computer-readable storage medium. Background technique [0002] With the substantial increase in the amount of computing, higher requirements are put forward for the stability of the server, and the premise of the stable operation of the server is the stability of the internal temperature. If the operating temperature of the server is too high, it will reduce the service life of the server and increase the Failure rate; if the temperature changes too much, it will cause the performance of each component to deteriorate, so the effect of the cooling system will directly lead to the fluctuation of the temperature of the surrounding environment. In related technologies, the temperature information is mainly obtained through the temperature sensor, and the temperature information is fed b...

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Problems solved by technology

[0002] With the substantial increase in the amount of computing, higher requirements are placed on the stability of the server, and the premise of the stable operation of the server is the stability of the internal temperature. If the server operating temperature is too high, it will reduce the service life of the server and increase the Failure rate; if the temperature changes too much, it will cause the performance of each component to deteriorate, so the effect of the cooling system will directly lead to the fluctuation of the temperature of the surrounding environment

In related technologies, the temperature information is mainly obtained through the temperature sensor, and the temperature information is fed back to the BMC (Baseboard Management Controller, Baseboard Management Controller) controller to achieve fan speed adjustment to achieve heat dissipation. Since the temperature and heat are directly proportional, the use of When the temperature sensor obtains the temperature to control the fan, the CPU temperature will rise due to the increase in the amount of calculation, and the heat sink used by the CPU (Central Processing Unit, central processing unit) generally has a certain heat capacity, which will cause the hysteresis of the temperature rise. The obtained temperature is lower than the actual CPU temperature; and, the temperature is provided by an external temperature sensor, which increases the time for the BMC to obtain the temperature, which will cause the actual CPU temperature to be much higher than the temperature obtained by the temperature sensor. Therefore, In related technologies, not only the real-time performance is poor, the accuracy is low, but also the cost is high

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