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Method for mounting a three-axis MEMS device onto substrate with precise orientation

一种基板、精准的技术，应用在微观结构装置、处理微观结构装置、组装微观结构装置等方向，达到容易垂直对齐并安装的效果

Active Publication Date: 2013-09-11
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is still a challenge to install z-axis (MEMS) sensing devices, how to achieve low cost under the conditions of limited space and high volume in the packaging field

Method used

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  • Method for mounting a three-axis MEMS device onto substrate with precise orientation
  • Method for mounting a three-axis MEMS device onto substrate with precise orientation
  • Method for mounting a three-axis MEMS device onto substrate with precise orientation

Examples

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Embodiment Construction

[0029] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] see figure 1 , which shows a compact three-axis MEMS device 10 . The three-axis MEMS device 10 includes a substrate 12, such as a lead frame, positioned in the xy plane. The substrate 12 includes a plurality of pads 17 and a bonding pattern (not shown), the pads 17 are used to mechanically and electrically couple the first subsystem to the substrate 12, for example, an application specific integrated circuit (ASIC) device 16, Or composite subsystems, a solder pattern is used to mechanically and electrically couple a second subsystem to the substrate 12, eg, the z-axis sensing device 15.

[0031] ASIC device 16 may be electrically and mechanically coupled to substrate 12 , for example, by flip chipping ASIC device 16 onto substrate 12 using several pads 17 . In order to minimize the volume of the three-axis MEMS device 10 , a multi-ax...

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PUM

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Abstract

This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.

Description

technical field [0001] The invention relates to a method for integrating a MEMS device with a substrate, in particular, a method for precisely integrating a three-axis MEMS device with a substrate. Background technique [0002] Currently, implementing navigation technology into small devices requires two- and three-axis microelectromechanical system (MEMS) sensors that feature small size in the xy plane and low height in the z-axis. However, it is still a challenge to install z-axis (MEMS) sensing devices, how to achieve low cost under the conditions of limited space and high volume in the packaging field. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for accurately integrating a three-axis MEMS device on a substrate for the above-mentioned technical difficulties, which uses surface tension to make the z-axis sensing device to be installed on the substrate or lead frame and the xy plane Precise angula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
CPCB23K1/0008B81B7/02B81B2201/025B81B2207/012B81C3/005B81C2203/057B81C2203/0792
Inventor 努尔丁·哈瓦特段志伟
Owner MEMSIC SEMICON WUXI