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Method for making side-lit light-emitting diodes

A technology of light-emitting diodes and manufacturing methods, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve the problems that light easily passes through the reflective layer, cannot be reflected to the side, and reduces luminous efficiency.

Active Publication Date: 2016-11-30
泰州市智谷软件园有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the light emitted by the light-emitting diode chip passes through the reflective layer, part of the light easily passes through the reflective layer and cannot be reflected to the side to exit, thereby reducing the luminous efficiency.

Method used

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  • Method for making side-lit light-emitting diodes
  • Method for making side-lit light-emitting diodes
  • Method for making side-lit light-emitting diodes

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0020] Figure 1 to Figure 10 It shows a method for manufacturing a side-lit light-emitting diode provided by an embodiment of the present invention, which includes the following steps:

[0021] Step 1: See figure 1 , provide a mold 10, the mold 10 includes an annular flat portion 11 and a protrusion 12 connected to the flat portion 11 and located in the flat portion 11, the flat portion 11 is matched with the protrusion 12 A receiving space 13 is formed, and an opening 121 is formed on the protrusion 12 . In this embodiment, the flat plate portion 11 is annular, the protruding portion 12 is approximately hemispherical, and the opening 121 is located at the center of the protruding portion 12 . The shapes of the flat plate portion 11 and the protruding portion 12 can be set according to the desired shape of the LED. The mold 10 has an inner surface 110 . It can be understood that the mold 10 may only have the protruding portion 12 instead of the flat plate portion 11 .

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PUM

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Abstract

A method for manufacturing side-lit light-emitting diodes, which includes: providing a mold; forming a reflective layer on the inner surface of the mold; providing a plate-shaped refraction tape, and the end of the refraction tape extends to the The edge of the protruding part; vacuuming through the opening of the protruding part to suck the refraction tape to form a refraction layer; providing a substrate on which at least two light emitting diode chips are arranged, the mold with the refraction layer will be formed setting on the substrate; injecting encapsulation glue into the accommodation space, and curing the encapsulation glue to form an encapsulation layer; removing the mold; cutting the substrate, encapsulation layer, refraction layer and reflective layer to form at least two side lights type light-emitting diodes.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a method for forming a side-view light-emitting diode with a refraction layer. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] In the existing manufacturing method of side-lit LEDs, generally, a reflective layer is provided on the light-emitting surface of the LED chip, so as to reflect the light emitted by the LED chip to the side for emission. However, when the light emitted by the light-emitting diode chip passes through the reflective layer, part of the light easily passes through the reflective layer and cannot be reflected to the side to exit, thereby...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/58H01L33/00
Inventor 罗杏芬
Owner 泰州市智谷软件园有限公司