Plate flatness correction unit and operation method thereof

Abstract

The invention provides a plate flatness correction unit and an operation method thereof. The plate flatness correction unit comprises a hydraulic control system, a correction table, an upper plate, and pressure posts. The correction table comprises a correction face used for holding a plate under correction. The upper plate faces the correction table so that correction space forms between the upper plate and the correction table. The pressure posts are disposed in the correction space and include the first and second pressure posts; one end of every pressure post is mounted on the upper plate, and the other end of every pressure post can press on the correction table under the internal hydraulic action of the post. The second pressure posts can be moved to multiple positions of the plate under correction to apply pressure. The correction unit has functions of multi-point support and fixation and multi-point pressure application; the pressures of the pressure points can be adjusted at the same time and can also be adjusted independently; accordingly, the problem that the plate under correction bears excessive pressure and is damaged during the simultaneous pressing process can be prevented, and the problem that the plate under correction is damaged due to bearing uneven pressure can also be prevented.

Description

technical field [0001] The invention relates to a hydraulic plate flatness correction device and an operation method thereof. Background technique [0002] Usually the target combination is composed of a target that meets the sputtering performance and a back plate with a certain strength. The target itself is large in size and easily deformed and broken. In order to fix the target well on the equipment, the target is usually welded to the back plate and then installed on the equipment. The backplane plays the role of support and fixation, and has the effect of conducting heat. During sputtering, target combinations are typically operated at temperatures between 200°C and 500°C. When working, one side of the target combination is filled with cooling water, while the other side is at 10 -9 In the high vacuum environment of Pa, there is a huge pressure difference on both sides of the target combination. Under such a harsh working environment, the backplane is prone to defo...

AI Technical Summary

Problems solved by technology

[0005] In view of this, the inventor provides a correction device to solve the problem that the existing technology cannot correct the large target combination backplane and the complex deformation of the target backplane

Images