Unlock instant, AI-driven research and patent intelligence for your innovation.

Lamination jig, lamination device, and reinforcement board lamination method using the lamination device

A technology of pressing jig and pressing device, which is applied in the direction of assembling printed circuits with electrical components, electrical components, and manufacturing of printed circuits, and can solve problems such as air bubbles and overflow of adhesive layers.

Active Publication Date: 2016-08-10
AVARY HLDG (SHENZHEN) CO LTD +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when pressing the reinforcing board, it is easy to cause the adhesive layer to overflow or generate air bubbles

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lamination jig, lamination device, and reinforcement board lamination method using the lamination device
  • Lamination jig, lamination device, and reinforcement board lamination method using the lamination device
  • Lamination jig, lamination device, and reinforcement board lamination method using the lamination device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0021] see figure 1 and image 3 , The pressing device 100 provided by the first embodiment of the present invention includes an upper pressing plate 10 , a lower pressing plate 20 and a pressing jig 30 . The pressing fixture 30 is carried on the lower pressing plate 20, and the upper pressing plate 10 is spaced opposite to the lower pressing plate 20 and is used for jointly pressing and reinforcing the soft-hard composite circuit board 40 carried on the pressing fixture 30. plate 46.

[0022] The rigid-flex composite circuit board 40 includes a flexible board 42 , six rigid boards 44 and two reinforcing boards 46 as described above. The flexible board 42 is a double-sided circuit board, which includes an upper surface 422 and a lower surface 424 opposite to the upper surface 422 . Three hard plates 44 in the six hard plates 44 are arra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a pressing fixture for bearing a soft-hard composite circuit board. The soft-hard composite circuit board comprises a soft plate, a plurality of hard plates and a plurality of stiffening plates, wherein the soft plate comprises an upper surface and a lower surface opposite to the upper surface; the hard plates are arranged on the upper surface and the lower surface in an up-down corresponding manner; stiffening areas are areas between adjacent hard plates on the left side and right side of the soft plate; the stiffening plates are glued on the upper surface and are respectively positioned in the stiffening areas. The pressing fixture comprises a baseplate and a plurality of buffering parts, wherein the baseplate comprises a bearing surface opposite to the lower surface; a plurality of storing holes are formed in the bearing surface; each storing hole is corresponding to one stiffening area; the buffering parts are fixedly arranged in the storing holes respectively and stick out relative to the bearing surface to bear the soft plate positioned in the stiffening areas. The invention further relates to a pressing device provided with the pressing fixture and a method for pressing the stiffening plates by adopting the pressing device.

Description

technical field [0001] The invention relates to a pressing technology, in particular to a pressing jig, a pressing device with the pressing jig and a method for pressing a reinforcing plate using the pressing device. Background technique [0002] With the continuous development of science and technology and the continuous improvement of the quality of life, coupled with the integration and continuous growth of the 3C industry, the application fields of integrated circuits are becoming wider and wider, such as notebook computers, mobile phones, digital cameras, printers and other electronic products. device. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Rigid-flex circuit boards are gradually and widely used in ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/36
Inventor 明波
Owner AVARY HLDG (SHENZHEN) CO LTD