Electronics and Grid Array Modules
An electronic device and grid array technology, applied in the field of electronics, can solve problems such as reducing the effective layout space of LGA modules, and achieve the effect of improving the effective layout space
Active Publication Date: 2017-07-14
HUAWEI DEVICE CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Since the SMA header on the LGA module occupies a certain surface area, the effective layout space of the LGA module is reduced
Method used
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Embodiment Construction
[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0047] In order to improve the effective layout space of the LGA module, the antenna can first be connected to the RF pad on the bottom board through the wiring on the printed circuit board of the bottom board, and connected to the RF pad of the LGA module through the RF pad on the bottom board, thereby realizing Interconnection of the antenna to the LGA module. The LGA module and the backplane may also be provided with pads for transmitting non-radio ...
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Embodiments of the present invention proposes an electronic device and a grid array LGA module, the electronic apparatus comprising: a first printed circuit board, the lower surface of the first printed circuit board having a first rf pad and a first non-radio frequency pad; The backplane, comprising a second printed circuit board, the upper surface of the second printed circuit board having a second RF pad and a second non-RF pad, wherein the first RF pad is connected to the second RF pad, the first non-RF pad is connected to the second non-RF pad; The antenna, located on the base plate, and is connected to a second RF pad, wherein the size of the first RF pad is less than the size of the first non-RF pad, the size of the second RF pad is less than the size of the second non-RF pad, the first RF pad and the second RF pad for transmitting the antenna transmitted radio frequency signal between the LGA module and the baseplate. Since the RF pad of the LGA module does not occupy the space on the top surface of the LGA module, the effective layout space of the LGA module is improved.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a grid array module. Background technique [0002] Land Grid Array (LGA) modules are more and more widely used in communication, vehicle, consumer electronics and other special fields. The LGA module has complete functions, for example, the LGA module usually has functions such as wireless reception, signal processing and wireless transmission. The LGA module includes a printed circuit board (Printed Circuit Broad, PCB) and pads. Due to the high wiring density of the LGA module, its printed circuit board usually adopts a high density interconnect (High Density Interconnect, HDI) printed circuit board. HDI printed circuit boards have thinner dielectrics, smaller dimensions, and allow for smaller device pitches. [0003] The antenna connected to the LGA module generally includes a main antenna, a secondary antenna, a Global Position System (Global Po...
Claims
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IPC IPC(8): H05K1/18H01Q1/22
CPCH01Q1/22H05K1/18H05K1/0243H05K1/111H05K1/141H05K1/16H05K2201/094H05K2201/10098H05K2201/10719Y02P70/50H01Q1/50
Inventor 黄本纬
Owner HUAWEI DEVICE CO LTD