Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic device and lattice array LGA module

An electronic device and grid array technology, applied in the electronic field, can solve problems such as reducing the effective layout space of LGA modules, and achieve the effect of improving the effective layout space

Inactive Publication Date: 2017-10-20
HUAWEI DEVICE CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the SMA header on the LGA module occupies a certain surface area, the effective layout space of the LGA module is reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device and lattice array LGA module
  • Electronic device and lattice array LGA module
  • Electronic device and lattice array LGA module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0047] In order to improve the effective layout space of the LGA module, the antenna can first be connected to the RF pad on the bottom board through the wiring on the printed circuit board of the bottom board, and connected to the RF pad of the LGA module through the RF pad on the bottom board, thereby realizing Interconnection of the antenna to the LGA module. The LGA module and the backplane may also be provided with pads for transmitting non-radio ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides an electronic device and a lattice array LGA module. The electronic device includes a first printed circuit board, the lower surface of the first printed circuit board having a first RF bonding pad and a first non-RF bonding pad; a bottom board comprising a second printed circuit board, the upper surface of the second printed circuit board having a second RF bonding pad and a second non-RF bonding pad, wherein the first RF bonding pad is connected to the second RF bonding pad, the first non-RF bonding pad is connected to the second non-RF bonding pad; an antenna located on the bottom board and connected to the second RF bonding pad, wherein the size of the first RF bonding pad is smaller than the size of the first non-RF bonding pad, the size of the second RF bonding pad is smaller than the size of the second non-RF bonding pad, and the first RF bonding pad and the second RF bonding pad are used to transmit RF signals transmitted by the antenna between the LGA module and the bottom board. Since the RF bonding pads of the LGA module do not occupy the top surface of the LGA module, the effective layout space of the LGA module is improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a grid array module. Background technique [0002] Land Grid Array (LGA) modules are more and more widely used in communication, vehicle, consumer electronics and other special fields. The LGA module has complete functions, for example, the LGA module usually has functions such as wireless reception, signal processing and wireless transmission. The LGA module includes a printed circuit board (Printed Circuit Broad, PCB) and pads. Due to the high wiring density of the LGA module, its printed circuit board usually adopts a high density interconnect (High Density Interconnect, HDI) printed circuit board. HDI printed circuit boards have thinner dielectrics, smaller dimensions, and allow for smaller device pitches. [0003] The antenna connected to the LGA module generally includes a main antenna, a secondary antenna, a Global Positioning System (Global...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H01Q1/22
CPCH01Q1/22H05K1/18H05K1/0243H05K1/111H05K1/141H05K1/16H05K2201/094H05K2201/10098H05K2201/10719Y02P70/50H01Q1/50
Inventor 黄本纬
Owner HUAWEI DEVICE CO LTD