Measuring method for diamond coating film-substrate interface bonding strength based on molecular dynamics

Abstract

The invention discloses a measuring method for diamond coating film-substrate interface bonding strength based on molecular dynamics. The method is mainly characterized in that with the help of the molecular dynamics theory and simulating calculation software, a hard alloy substrate diamond coating film-substrate interface model is established, simulating calculation is performed on the mechanical property of a film-substrate interface, a hard alloy substrate diamond coating film-substrate interface bonding strength predicating model is established based on a simulating result, and the diamond coating film-substrate interface bonding strength is accurately measured through the predicting model. In this way, the defects that various existing experimental measurement methods, such as a scraping method, an indentation method and a bubbling method, are long in consumed time and low in measuring accuracy are overcome, a basis and a foundation can be provided for optimizing and industrializing a diamond coating technology, and the measuring method has wide application prospects.

Description

technical field [0001] The invention relates to a testing technique for quantitatively detecting the interfacial bonding strength of a diamond coating film on a cemented carbide substrate, in particular a testing technique for measuring the interfacial bonding strength of a diamond coating film using a molecular dynamics method, which belongs to the mechanical surface effect and surface technology fields. Background technique [0002] Diamond has become an ideal tool material due to its excellent properties such as high hardness, high thermal conductivity, low friction coefficient, low thermal expansion coefficient, and good chemical stability. It has been widely used in the field of diamond-coated cutting tools, but it has not yet Realize large-scale production. One of the main reasons is that there is a lack of unified standards for the evaluation of the intrinsic quality (mainly mechanical properties) of diamond coatings, especially the evaluation of the bonding stre...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome many deficiencies such as the incapability of accurate quantitative detection and the limitation of the shape of the substrate in the existing diamond coating film-substrate interface bonding strength detection method, the present invention provides a method for measuring the diamond coating film-base interface bonding strength based on molecular dynamics. The measurement method can not only accurately and quantitatively determine the bond strength of the film-substrate interface of the diamond coating, but also is not limited by the shape of the substrate, and can be conveniently used for the measurement of the bond strength of the diamond-coated film-substrate interface on complex-shaped substrates

Images