Laser leveling method of thin wall slide plate

Abstract

The invention relates to a laser leveling method of a thin wall slide plate, which comprises the following steps: A)treating surface of the thin wall slide plate, detecting; B)using laser for scanning a lug boss of the thin wall slide plate, taking central section of a highest point and a lowest point as an origin, taking a deformed length direction as a scan direction for scanning, performing laser quenching; while laser scanning, employing an auxiliary water cooling mode on a non-quenching position, and preventing heat diffusion while scanning; and C)detecting. The laser leveling method employs specific advantage of a laser surface technology, employs a reasonable laser back pull correction action, special processing is not required on parts, secondary processing is required, flatness can be recovered at one time, original heat treatment performance of the slide plate is not influenced, correction position and scope can be controlled in a flexible mode, high point can be corrected in a target mode, stress is smooth, local bending due to local point-like stress is not generated, good correction effect can be reached, and the method saves processing period, economic cost and manpower resource for enterprise.

Description

technical field [0001] The invention relates to laser leveling technology, in particular to a laser leveling method for a thin-walled slide plate. Background technique [0002] Thin-walled skateboards and liners are indispensable in steel and iron production, metal products, molds, processing machine tools and other industries. Since skateboards are used in precision machining and other fields, they have good wear resistance and flatness. Very demanding. In the heat treatment strengthening and processing industries of skateboards, the quenching of thin-plate workpieces will have insurmountable deformation problems. The common practice is to use mechanical pressure to correct the skateboards after quenching. However, due to the hard structure and increased brittleness of the material after quenching, the thin plate is easy to crack under the action of pressure, resulting in the scrapping of the workpiece. And the method of mechanical correction is local application of force...

AI Technical Summary

Problems solved by technology

However, due to the hard structure and increased brittleness of the material after quenching, the thin plate is easy to crack under the action of pressure, resulting in the scrapping of the workpiece

And the method of mechanical correction is local application of force, which will cause the correction of the skateboard to show waves and irregular deformation.

The ideal correction effect cannot be achieved, and thus wastes financial resources, manpower, material resources and time, and increases processing costs and manufacturing cycles