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Tire pressure sensor packaging lead frame

A tire pressure sensor, packaging lead technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device components, etc., can solve the problems of complex chip process, difficult chip installation, complicated lead frame manufacturing process, etc. Effects of electrical and thermal conductivity, good oxidation and corrosion resistance, good thermal matching

Active Publication Date: 2015-01-28
GUANGDONG YUEJING HIGH TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manufacturing process of the traditional lead frame is complicated, and the process is complicated when installing the chip, which requires more manpower and material resources, and the lead frame is easy to shift, making it difficult to install the chip

Method used

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  • Tire pressure sensor packaging lead frame
  • Tire pressure sensor packaging lead frame

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0019] Such as figure 1 Shown is a structural schematic diagram of the tire pressure sensor packaging lead frame.

[0020] A tire pressure sensor packaging lead frame is used for fixedly connecting a tire pressure sensor chip, a main control chip and a transmitting chip; it includes a frame body, and the frame body is made of nickel-palladium-gold material.

[0021] The frame body includes a first base island 101, a second base island 102, a first lead wire 104 and a second lead wire 103; the first base island 101 and the second base island 102 are arranged on the The center of the frame body; the first base island 101 is used to install the main control chip and the emitting chip; the second base island 102 is provided with a through hole in the center, and the through hole is used to sense the external air pressure. The second base island 102 is used to fix the tire pressure sensor chip; the first lead line 104 is T-shaped, and the first lead line 104 is arranged on opposit...

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Abstract

The invention provides a tire pressure sensor packaging lead frame which is used for being fixedly connected with a tire pressure sensor chip, a main control chip and a transmitting chip. The lead frame comprises a frame body which is made of nickel porpezite materials. The frame body comprises a first substrate, a second substrate, first pin wires and second pin wires. The first substrate and the second substrate are arranged in the center of the frame body. The first substrate is used for mounting the main control chip and the transmitting chip. A through hole is formed in the center of the second substrate and used for sensing the outside air pressure. The second substrate is used for fixing the tire pressure sensor. The first pin wires are in a T shape and are arranged on the opposite two sides of the first substrate. The second pin wires stretch and are distributed in the length direction of the side edge of the second substrate. The first pin wires and the second pin wires are used for transmitting signals of the main control chip, the transmitting chip and the tire pressure sensor to an external device respectively. The frame body is made of the nickel porpezite materials, and a later electroplating technology is omitted. Meanwhile, the lead frame has good electrical conductivity and thermal conductivity after the nickel porpezite materials are adopted.

Description

technical field [0001] The invention relates to a lead frame, in particular to a tire pressure sensor packaging lead frame which is simple to manufacture and quick to install. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. It is mainly produced by die stamping method and chemical etching method. The manufacturing process of the traditional lead frame is complicated, and the process is complicated when installing the chip, which requires more manpower and material resources, and the lead frame is easy to shift, making it difficult to ins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
Inventor 李莉胡伍妹王利萍晏承亮黄钟坚朱志牛
Owner GUANGDONG YUEJING HIGH TECH CO LTD
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