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Package with thermal interface material on sidewalls of stacked dies

A thermal interface material, stacking technology, applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problem of ineffective heat conduction, preventing effective heat dissipation, etc.

Active Publication Date: 2017-08-08
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat dissipation in 3DIC is challenging
However, between stacked dies, there are other materials that do not conduct heat efficiently, such as underfill, molding compound, etc.
Also, stacked die can be molded in a molding compound that prevents effective heat dissipation

Method used

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  • Package with thermal interface material on sidewalls of stacked dies
  • Package with thermal interface material on sidewalls of stacked dies
  • Package with thermal interface material on sidewalls of stacked dies

Examples

Experimental program
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Embodiment Construction

[0035] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are illustrative and do not limit the scope of the invention.

[0036] A package having improved heat dissipation capability and a method of forming the same are provided according to various exemplary embodiments. Intermediate stages in forming the package are shown. Variations of the embodiments are discussed. Like reference numerals are used to designate like elements throughout the various drawings and exemplary embodiments.

[0037] figure 1 A cross-sectional view showing initial stages of forming a three-dimensional integrated circuit (3DIC) package 100 including die 10 stacked on die 12 . In some embodiments, die 10 is a memory die forming a memory stack. However, in alternative embodiment...

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PUM

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Abstract

The present invention discloses a package with thermal interface material on sidewalls of stacked dies, comprising: a die stack with at least two stacked dies and a thermal interface material (TIM). The TIM includes a top portion above and in contact with the top surface of the die stack and a sidewall portion extending downward from the top portion below at least one of the at least two stacked dies. A first metal heat sink is positioned over and in contact with the top portion of the TIM. The second metal heat sink has sidewalls in contact with sidewalls of the sidewall portions of the TIM.

Description

[0001] Cross References to Related Applications [0002] This patent application is related to U.S. Patent Application Serial No. 13 / 957,727 (Attorney Docket TSM13-0437), entitled "3DIC Packages with HeatDissipation Structures," filed August 2, 2013, the entire contents of which are incorporated herein as refer to. technical field [0003] The present invention relates generally to integrated circuits and, more particularly, to packages having thermal interface material on the sidewalls of stacked die. Background technique [0004] In the packaging of integrated circuits, semiconductor die may be stacked by bonding, and the semiconductor die may be bonded to other packaging components, such as interposers and packaging substrates. The resulting package is known as a three-dimensional integrated circuit (3DIC). Heat dissipation in 3DIC is challenging. There is a bottleneck in efficiently dissipating the heat generated by the internal die of the 3DIC. The heat generated by...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/36
CPCH01L23/42H01L23/36H01L23/3675H01L23/10H01L23/3128H01L23/49816H01L23/5385H01L2224/16145H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/0002H01L2924/15174H01L2924/15311H01L2924/18161H01L2924/00
Inventor 余振华洪文兴黄思博苏安治李祥帆陈锦棠吴集锡郑心圃
Owner TAIWAN SEMICON MFG CO LTD