A processing method for back drilling of printed circuit board and printed circuit board
A technology for printed circuit boards and processing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve problems such as small diameter of through-holes, inability to discharge drilling chips in time, influence of client signal reliability and stability, etc. , to achieve the effect of improving technical capabilities and improving plugging defects
Active Publication Date: 2017-07-28
NEW FOUNDER HLDG DEV LLC +1
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- Description
- Claims
- Application Information
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Problems solved by technology
[0004] In order to solve the problem that the diameter of the through hole of the existing printed circuit board is too small, the drilling chips cannot be discharged in time during the processing, and the drilling chips will block the hole, resulting in the reliability and stability of the client signal being affected by the drilling chips
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[0018] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0019] Such as figure 1 As shown, it is a processing flowchart of the printed circuit board back drilling of an embodiment of the present invention, including the following steps:
[0020] Step S101: processing a through hole with a first aperture on the printed circuit board;
[0021] Step S102: processing one end of the through hole to form a stepped hole larger than the first hole diameter;
[0022] Step S103: electroplating the through hole to form a plating layer;
[0023] Step S104: Back-drilling the stepped hole to remove excess plating.
[0024] In the present invention, by adding a depth-controlled drilling with a larger diameter during the through-drilling, the through-holes that need to be back-drilled are made into stepped holes first, and...
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The invention provides a backdrill processing method of a printed circuit board and the printed circuit board. The method includes the following steps: machining a first through hole with a first aperture in the printed circuit board; machining one end of the through hole so that a stepped hole larger than the first aperture is formed; carrying out electroplating processing on the through hole so that a plating layer is formed; and carrying out backdrill processing on the stepped hole and removing the redundant plating layer. Through adding of depth-control drilling of an increased diameter during through drilling, the through hole which needs backdrill is firstly manufactured into the stepped hole and then backdrill machining is carried out after electroplating, that is, the difficulty of backdrill of the through hole is reduced into common backdrill machining so that hole-block defects of through-hole backdrill can be effectively reduced and the technical capability of backdrill is improved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a processing method for back drilling of a printed circuit board and a printed circuit board. Background technique [0002] Back-drilling technology has been widely used in the existing circuit board design. With the high-density trend of printed circuit boards, the through-holes on printed circuit boards also tend to develop in the direction of micro-holes, and some have reached below 0.3mm. The biggest difficulty in back-drilling existing micro-holes is that the cuttings cannot be discharged in time during the back-drilling process, resulting in the problem of drilling cuttings blocking the hole, and finally causing the reliability and stability of the client signal to be affected by the cuttings, thereby affecting the The quality of the circuit board. [0003] At present, there is no effective technical solution for micro-hole back drilling smaller than 0.5mm...
Claims
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IPC IPC(8): H05K3/42H05K1/11
CPCH05K1/116H05K3/0047H05K3/42H05K2201/09845H05K2203/0214H05K2203/0242
Inventor 李小晓张晓杰舒明
Owner NEW FOUNDER HLDG DEV LLC