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Boundary condition testing device for forging temperature field

A boundary condition and testing device technology, applied in the field of forging temperature field boundary condition testing devices, can solve the problems of severe heat exchange, inability to measure, large contact heat transfer coefficient, etc.

Inactive Publication Date: 2017-05-24
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the disadvantage of this technology is that the contact heat transfer coefficient obtained by the test, especially the contact heat transfer coefficient between solids, such as hot forging, the biggest factor affecting the test results is the pressure between the two, the greater the pressure, The more intense the heat exchange between the two, that is, the greater the contact heat transfer coefficient
[0005] The existing technology mainly measures the heat transfer coefficient between the liquid steel ingot and the ingot mold, and cannot measure the value of the contact heat transfer coefficient under a certain load when two solids are in contact with each other for heat transfer.

Method used

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  • Boundary condition testing device for forging temperature field

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Embodiment 1

[0025] like figure 1 As shown, the present embodiment includes: a sample 5, a fixing mechanism for fixing the sample 5, a test mold, some thermocouples 7 and a temperature acquisition module 10 thereof, and a calculation control module 11, wherein: some pairs of thermocouples 7 are buried in the test mold, The fixing mechanism and the test mold are set up and down relative to each other. The temperature acquisition module 10 collects the temperature values ​​of each thermocouple 7 at different times, and transmits the temperature values ​​to the calculation control module 11. The calculation control module 11 discretely analyzes the complete contact between the sample 5 and the test mold. For several sub-processes, it is considered that in each sub-process, the contact surface temperature between the test mold and sample 5 remains constant, that is, the temperature difference remains constant, and only a sudden change occurs at the beginning of the next sub-process, so as to ob...

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Abstract

A device for testing boundary conditions of a forging temperature field in the material field by use of a heat method comprises a fixing mechanism used for fixing a part to be tested, a testing die, a plurality of thermocouples, a temperature collection module and a computation control module, wherein the thermocouples are buried in the testing die; the fixing mechanism and the testing die are oppositely arranged up and down; the temperature collection module is used for collecting the temperature values of all the thermocouples at different time and transmitting the temperature values to the computation control module; and the computation control module obtains heat exchange coefficients between a sample and the testing die according to the complete contact time of the part to be tested and the testing die and the contact surface temperature. The device is suitable for test research on the high-temperature solid contact heat exchange coefficients.

Description

technical field [0001] The invention relates to a device in the field of testing materials using a thermal method, in particular to a testing device for the boundary condition of a forging temperature field. Background technique [0002] In the forging process, the temperature field needs to establish a heat transfer model, and the selection of the contact heat transfer coefficient between the workpiece and the die is particularly important for the establishment of the heat transfer model. It directly affects the accuracy of temperature field calculation, and the accuracy of temperature field calculation directly affects the accuracy of tissue field, stress field and strain field calculation. Therefore, the determination of the contact heat transfer coefficient between the workpiece and the mold is a source problem. If the coefficient is not selected accurately, it will lead to the failure of the simulation of the entire forging process. [0003] Therefore, it is very neces...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
Inventor 张举崔振山
Owner SHANGHAI JIAOTONG UNIV