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Method for patting and pressing copper block embedded in electroplated aluminum substrate

A technology of aluminum substrate and copper block, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as inability to adapt to mass production and complex technology

Inactive Publication Date: 2015-05-20
DONGGUAN ZHONGDIAN AIHUA ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a method of clapping and pressing copper embedded in electroplated aluminum substrates to solve the problem that although the heating technology in the prior art can also solve the problem of interference fit, this technology is relatively complicated and cannot be adapted to mass production.

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  • Method for patting and pressing copper block embedded in electroplated aluminum substrate
  • Method for patting and pressing copper block embedded in electroplated aluminum substrate

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Embodiment Construction

[0014] The embodiments of the present invention will be described in detail below with reference to the drawings.

[0015] See figure 1 , Is a schematic diagram of the copper block of the present invention and the matching hole of the aluminum plate achieving a clearance-free fit and embedding. Wherein, the aluminum base plate 1 is processed with H7 precision for the aluminum plate fitting hole 2, and the copper block 3 is processed with H7 precision. The width of the copper block 3 is 1 mm wider than the width of the corresponding embedded aluminum plate fitting hole 2. A punch above 100T presses the copper block 3 so that the copper block 3 is evenly expanded in the aluminum plate matching hole 2 so that the copper block 3 and the aluminum plate matching hole 2 achieve a gapless fit and embedment.

[0016] See again figure 2 A preferred embodiment of the present invention provides a method for tapping and pressing a copper-embedded block on an electroplated aluminum substrate, ...

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Abstract

The invention discloses a method for patting and pressing a copper block embedded in an electroplated aluminum substrate. The method comprises the steps that firstly, an aluminum substrate matching hole is formed in the aluminum substrate according to H7-level precision; secondly, the copper block is machined according to H7-level precision, wherein the width of the copper block is one millimeter larger than that of the aluminum substrate matching hole into which the copper block is embedded; thirdly, a punch is used for patting and pressing the copper block to enable the copper block to be evenly expanded in the aluminum substrate matching hole so that the copper block can be embedded into the aluminum substrate matching hole in a gapless fit mode. According to the method, the punch is used for patting and pressing the copper block to enable the copper block to be evenly expanded in the aluminum substrate matching hole so that the copper block can be embedded into the aluminum substrate matching hole in the gapless fit mode, good gapless fit embedding can be guaranteed, and there is no gap at the matching position after electroplating is conducted.

Description

Technical field [0001] The invention relates to an electroplating interference fit technology, in particular to a method for tapping an electroplated aluminum substrate embedded with a copper block. Background technique [0002] At present, the well-known fit with bearing capacity is interference fit, but for electroplated products, the interference fit must have a higher processing accuracy and a considerable fit length. A proper press-in method can ensure a good fit. After electroplating, there can be no gaps in the matching parts, and 100% good products cannot be guaranteed. Although heating technology can also solve this problem, this technology is more complicated and cannot be adapted to mass production. Summary of the invention [0003] The purpose of the present invention is to provide a method for embedding copper blocks on an electroplated aluminum substrate to solve the problem of interference fit that can be solved by the heating technology in the prior art, but this ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/02B23P17/00
CPCB23P19/021B23P17/00
Inventor 李建营向玉锋
Owner DONGGUAN ZHONGDIAN AIHUA ELECTRONICS
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