A method for surface modification of non-metallic powder in waste circuit boards

A waste circuit board and surface modification technology, which is applied in the field of surface modifier of non-metallic powder and its modification preparation, can solve the problems of waste circuit board being difficult to burn, producing dioxin, polluting the environment, etc. Physical and chemical properties, high degree of activation, and the effect of avoiding environmental pollution

Active Publication Date: 2017-05-31
WUXI ZHONGTIAN SOLID WASTE DISPOSAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional disposal methods of non-metal powder are incineration and landfill. Incineration can recover energy, but it will produce toxic and harmful substances such as dioxin, and waste circuit boards are difficult to burn because they contain fillers such as glass fibers.
Landfill not only occupies land, but also pollutes the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A modified non-metal powder in waste circuit boards is prepared from the following components according to the solid-to-liquid ratio: non-metal powder: borate coupling agent: liquid paraffin=100:1:4. The particle size of the used waste circuit board non-metallic powder is 300 mesh.

[0024] The modification of the non-metallic powder in the waste circuit board adopts a dry modification method. The specific steps are: respectively weigh 1 part of borate coupling agent, 4 parts of liquid paraffin and 100 parts of non-metallic powder, heat the weighed liquid paraffin to 70°C, and at the same time, weigh the weighed borate coupling agent The agent is dissolved in liquid paraffin, heated and stirred evenly, sprayed into a high-temperature heating mixer and mixed with pre-weighed non-metallic powder for high-speed modification, the modification temperature is controlled at 90 ° C, the modification time is 8 minutes, and the high temperature heating is controlled. The mixing ...

Embodiment 2

[0027] A modified non-metallic powder in a waste circuit board, prepared from the following components according to the solid-to-liquid ratio: non-metallic resin powder: isopropoxy tricarboxylic acid acyl titanate coupling agent LD-101: Liquid paraffin=100:0.8:4. The particle size of the used waste circuit board non-metallic powder is 200 mesh.

[0028] The modification of the non-metallic powder in the waste circuit board adopts a dry modification method. The specific steps are: respectively weigh 10.8 parts of isopropoxytricarboxylic acid acyl titanate coupling agent LD-10, 4 parts of liquid paraffin and 100 parts of non-metallic powder, heat the weighed liquid paraffin to 80°C, and simultaneously Dissolve the weighed isopropoxytricarboxylic acid acyl titanate coupling agent LD-101 in liquid paraffin, heat and stir evenly, then spray it into a high-temperature heating mixer and mix it with the pre-weighed non-metallic powder. High-speed mixing modification, the modificatio...

Embodiment 3

[0031] A modified non-metallic powder in waste circuit boards, prepared from the following components according to the solid-to-liquid ratio: non-metallic resin powder: monoalkoxy unsaturated fatty acid titanate LD-105: aluminum zirconate Coupling agent LD-139: liquid paraffin=100:0.5:0.5:4. The particle size of the used waste circuit board non-metallic powder is 100 mesh.

[0032] The modification of the non-metallic powder in the waste circuit board adopts a dry modification method. The specific steps are: respectively weigh 0.5 parts of monoalkoxy unsaturated fatty acid titanate LD-105, 0.5 parts of aluminum zirconate coupling agent LD-1390.5 parts, 4 parts of liquid paraffin and 100 parts of non-metallic powder, and weigh the Heat the liquid paraffin to 80°C, and dissolve the weighed monoalkoxy unsaturated fatty acid titanate LD-105 and aluminum zirconate coupling agent LD-139 in the liquid paraffin, heat and stir evenly, and spray on Perform high-speed mixing and modifi...

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PUM

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Abstract

The invention discloses a surface modification method for nonmetal powder in waste circuit boards. The nonmetal powder in the waste circuit boards, a surface modifier and a modification auxiliary are uniformly mixed in the mass ratio of 100:(0.3-1.5):4 by the aid of a high-temperature heating type mixer and are modified in the temperature ranging from 80 DEG C to 120 DEG C. Reutilization of resources of the waste circuit boards is realized, the problem of environment pollution caused during treatment of the waste circuit boards is solved, the production cost is saved, energy conservation and emission reduction are realized, huge economic benefits are created, and the great environmental protection significance is realized.

Description

technical field [0001] The invention relates to the technical field of comprehensive utilization of solid waste, in particular to a surface modifier of non-metal powder in waste circuit boards and a modification preparation method thereof. Background technique [0002] The main sources of discarded circuit boards are waste electronic and electrical products and scraps generated during the production of printed circuit boards, of which scraps account for about 15% of the total printed circuit boards. my country is not only a big producer and consumer of household appliances, but also a big producer of printed circuit boards, which will generate 2.3 million tons of electronic waste every year. [0003] The traditional disposal methods of non-metal powder are incineration and landfill. Incineration can recover energy, but it will produce toxic and harmful substances such as dioxin, and waste circuit boards are difficult to burn because they contain fillers such as glass fibers....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L91/06C08K13/04C08K7/14C08K5/10C08K5/5419C08K5/11
Inventor 王浩夏燕兰张玉芳李祥
Owner WUXI ZHONGTIAN SOLID WASTE DISPOSAL CO LTD
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