Unlock instant, AI-driven research and patent intelligence for your innovation.

Outer-layer ultra-thick copper circuit board and drilling method thereof

A drilling method and circuit board technology are applied in the directions of printed circuit components, electrical connection printed components, and printed component electrical connection formation. Dense interconnect conduction, reducing the effect of occupying wiring space

Active Publication Date: 2018-08-03
SHENNAN CIRCUITS
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides an outer layer ultra-thick copper circuit board and its drilling method to solve the problem that in the prior art only metallized through holes with a diameter of not less than 0.8mm can be used on the outer layer ultra-thick copper circuit board for interlayer Interconnection, resulting in a large amount of wiring space and the technical problem of being unable to achieve dense interconnection and conduction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Outer-layer ultra-thick copper circuit board and drilling method thereof
  • Outer-layer ultra-thick copper circuit board and drilling method thereof
  • Outer-layer ultra-thick copper circuit board and drilling method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Please refer to figure 1 , an embodiment of the present invention provides a drilling method for an outer layer ultra-thick copper circuit board, the method may include:

[0026] 110. Provide an outer layer ultra-thick copper circuit board, the outer layer ultra-thick copper circuit board comprising an inner layer board and two outer layers of ultra-thick copper foil layers laminated on both sides of the inner layer board respectively.

[0027] Such as Figure 2a As shown, the outer-layer ultra-thick copper circuit board in the embodiment of the present invention includes: an inner-layer board 20 and two outer-layer ultra-thick copper foil layers 30 pressed on both sides of the inner-layer board 20 respectively. Wherein, said inner layer board 20 is a common copper thick multi-layer board, which may include at least one circuit layer, and the thickness of the circuit layer is generally less than 1 ounce (OZ, 1OZ is approximately equal to 0.035 mm), and at most no more ...

Embodiment 2

[0041] Please refer to Figure 2d , an embodiment of the present invention provides an outer layer ultra-thick copper circuit board, which may include:

[0042] The inner layer board 20 and the two outer layers of ultra-thick copper foil layers 30 pressed on both sides of the inner layer board 20 respectively;

[0043] The two sides of the outer layer ultra-thick copper circuit board have at least one pair of blind holes 40, wherein each pair of two blind holes 40 are respectively located on both sides of the outer layer ultra-thick copper circuit board and the positions are corresponding, located on either side The blind hole runs through the outer super-thick copper foil layer 30 on the surface where it is located;

[0044]The outer super-thick copper circuit board also has at least one through hole 50 , wherein each through hole 50 passes through a pair of blind holes 40 , and the diameter of the through holes 50 is smaller than the diameter of the blind holes 40 .

[004...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an outer-layer ultra-thick copper circuit board and a drilling method thereof, in order to solve the problem that in the prior art, only metallized through holes with a diameter of not less than 0.8mm can be used on the outer-layer ultra-thick copper circuit board for interlayer interconnection. The connection leads to the technical problem of occupying a large amount of wiring space and failing to achieve dense interconnection and conduction. The above method may include: providing an outer layer ultra-thick copper circuit board, the outer layer ultra-thick copper circuit board including an inner layer board and two outer layer ultra-thick copper foil layers respectively pressed on both sides of the inner layer board; At least one pair of blind holes are processed on the outer layer ultra-thick copper circuit board, wherein the two blind holes of each pair are respectively located on both sides of the outer layer ultra-thick copper circuit board and the positions are corresponding, and the blind holes on any side The hole runs through the outer layer of ultra-thick copper foil layer on the surface; at least one through hole is processed on the outer layer of ultra-thick copper circuit board, wherein each through hole passes through a pair of blind holes, and the diameter of the through hole is less than The diameter of the blind hole.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an outer-layer ultra-thick copper circuit board and a drilling method thereof. Background technique [0002] For circuit board products with ordinary copper thickness, the simplest way to connect the inner and outer layers is to use a metallized hole (PLATING Through Hole, PTH) with a diameter of 0.25-0.35mm. [0003] In order to facilitate the input of high power, there are more and more circuit board products with super thick copper on the outer layer and normal thick copper on the inner layer. However, because the outer layer of this type of circuit board is ultra-thick copper, the conduction between the power modules on the outer layer and the conduction between the power module on the outer layer and the signal module on the inner layer cannot use 0.25-0.35mm in diameter. To achieve tiny metallized holes, only metallized holes with a diameter of 0.8mm or larger can b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42
Inventor 郭长峰刘宝林罗斌
Owner SHENNAN CIRCUITS